Memory device having variable impedance memory cells and time-to-transition sensing of data stored therein

ABSTRACT

The present disclosure relates to circuits, systems, and methods of operation for a memory device. In an example, a memory device includes a plurality of memory cells, each memory cell having a variable impedance that varies in accordance with a respective data value stored therein; and a read circuit configured to read the data value stored within a selected memory cell based upon a variable time delay determination of a signal node voltage change corresponding to the variable impedance of the selected memory cell.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. application Ser. No.16/040,419 titled “Memory Device Having Variable Impedance Memory Cellsand Time-to-Transition Sensing of Data Stored Therein,” filed Jul. 19,2018 (now U.S. Pat. No. 10,269,413), which claims the benefit under 35U.S.C. § 119(e) of U.S. Provisional Application No. 62/650,067 filedMar. 29, 2018, entitled “Memory Structures and Related Methods ofOperation,” and further claims the benefit under 35 U.S.C. § 119(e) ofU.S. Provisional Application No. 62/573,460 filed Oct. 17, 2017,entitled “Memory Operation.” All applications are incorporated herein byreference in their entirety.

TECHNICAL FIELD

The present disclosure relates to circuits, systems, and methods ofoperation for a memory device, and more particularly relates to deviceswhose memory cells have a variable impedance that varies in accordancewith a respective data value stored therein.

BACKGROUND

Memory may be used for many different types of purposes in a computingsystem. For example, memory may be used to store data or performmathematical operations. Different types of memory may be used for thesevarious purposes. Dynamic random-access memory (DRAM) may be used insituations that benefit from low-cost and high-capacity memory, and maybe used in main memory components of a computing system. DRAM may beslower than other kinds of memory such as static random-access memory(SRAM).

SUMMARY

Memory devices are disclosed that generally perform a time delaydetermination of a voltage change on a signal node to determine the datavalue stored within a selected memory cell.

In one disclosed embodiment, a memory device includes a plurality ofmemory cells, each memory cell having a variable impedance that variesin accordance with a respective data value stored therein. The memorydevice also includes a read circuit configured to read the data valuestored within a selected memory cell based upon a variable time delaydetermination of a signal node voltage change corresponding to thevariable impedance of the selected memory cell.

In another disclosed embodiment, a memory device includes a plurality ofmemory cells in an array, and a read circuit. The read circuit isconfigured to effect a voltage transition of a signal node at a variablerate corresponding to a data value stored within a selected memory cell,and to perform a time-to-transition measurement of the signal node todetermine the data value stored within the selected memory cell.

BRIEF DESCRIPTION OF THE DRAWINGS

For a detailed description of various embodiments, reference will now bemade to the accompanying drawings in which:

FIG. 1 shows, in block diagram form, an example computing systemcomprising memory structures in accordance with at least someembodiments;

FIG. 2 shows, in partial block diagram form, DRAM memory cells andcharacteristics associated with each type of DRAM memory cell;

FIG. 3 shows an example graph depicting a relationship between currentand voltage in a transistor;

FIG. 4 shows a DRAM memory cell and a corresponding read operation inaccordance with at least some embodiments;

FIG. 5 shows a memory cell and a corresponding read operation inaccordance with at least some embodiments;

FIG. 6 shows diagrams of circuits demonstrating charge sharing;

FIG. 7 shows a memory cell and a corresponding read operation inaccordance with at least some embodiments;

FIG. 8 shows a circuit configuration and a corresponding read operationin accordance with at least some embodiments;

FIG. 9 shows a circuit configuration and a corresponding read operationin accordance with at least some embodiments;

FIG. 10 shows a circuit configuration in accordance with at least someembodiments

FIG. 11 shows a memory cell and a corresponding read operation inaccordance with at least some embodiments;

FIG. 12 shows a plurality of memory cells in a NAND arrangement and acorresponding read operation in accordance with at least someembodiments;

FIG. 13 shows a 1T DRAM memory cell and a corresponding read operationin accordance with at least some embodiments;

FIG. 14 shows a circuit configuration in accordance with at least someembodiments;

FIG. 15 shows, in block diagram form, a time-to-delay measurementcircuit and a read operation in accordance with at least someembodiments;

FIG. 16 shows an example method in accordance with at least someembodiments;

FIG. 17 shows an example method in accordance with at least someembodiments;

FIG. 18 shows an example method in accordance with at least someembodiments;

FIG. 19 shows an example method in accordance with at least someembodiments;

FIG. 20 shows, in block diagram form, a circuit configuration inaccordance with at least some embodiments;

FIG. 21 shows a circuit configuration in accordance with at least someembodiments;

FIG. 22 shows a circuit configuration in accordance with at least someembodiments;

FIG. 23 shows, in block diagram form, a circuit configuration inaccordance with at least some embodiments;

FIG. 24 shows, in block diagram form, a circuit configuration inaccordance with at least some embodiments;

FIG. 25 shows a circuit configuration in accordance with at least someembodiments;

FIG. 26 shows, in partial block diagram form, a circuit configuration inaccordance with at least some embodiments;

FIG. 27 shows, in partial block diagram form, a circuit configuration inaccordance with at least some embodiments;

FIG. 28 shows a corresponding read operation in accordance with at leastsome embodiments, including the embodiment shown in FIG. 27;

FIG. 29 shows a circuit configuration and corresponding readcharacteristics in accordance with at least some embodiments; and

FIG. 30 shows, in partial block diagram form, a circuit configuration inaccordance with at least some embodiments.

FIG. 31 shows, in partial block diagram form, a circuit configuration inaccordance with at least some embodiments.

FIG. 32 shows, in partial block diagram form, a circuit configuration inaccordance with at least some embodiments.

FIG. 33 shows a flowchart of an example method in accordance with atleast some embodiments.

FIG. 34 shows, in block diagram form, a time-to-transition measurementcircuit configuration in accordance with at least some embodiments.

FIG. 35 shows, in block diagram form, a circuit configuration inaccordance with at least some embodiments.

It should be noted that the structures and timing diagrams depicted inthe various figures are not necessarily drawn to scale, but rather aredrawn in a manner to more clearly illustrate the teachings depictedtherein.

DETAILED DESCRIPTION

Certain terms are used throughout the following description and claimsto refer to particular system components. As one skilled in the art willappreciate, different companies may refer to a component by differentnames. This document does not intend to distinguish between componentsthat differ in name but not function.

In the following discussion and in the claims, the terms “including” and“comprising” are used in an open-ended fashion, and thus should beinterpreted to mean “including, but not limited to . . . .” Also, theterm “couple” or “couples” is intended to mean either an indirect ordirect connection. Thus, if a first device couples to a second device,that connection may be through a direct connection or through anindirect connection via other devices and connections.

The following discussion is directed to various embodiments of theinvention. Although one or more of these embodiments may be preferred,the embodiments disclosed should not be interpreted, or otherwise used,as limiting the scope of the disclosure, including the claims. Inaddition, one skilled in the art will understand that the followingdescription has broad application, and the discussion of any embodimentis meant only to be exemplary of that embodiment, and not intended tointimate that the scope of the disclosure, including the claims, islimited to that embodiment.

The ability to store multiple bits in a single memory cell may bebeneficial to computer users. The ability to store multiple bits in asingle memory cell allows more data to be stored in the same physicalspace. Furthermore, the ability to perform mathematical operations usingmemory cells may be beneficial to machine language programmers. In orderto implement both the ability to store multiple bits in a single memorycell as well as improve on an ability to perform mathematical operationsusing memory cells, various methods and systems are described below,directed to interpreting data stored in a memory cell.

FIG. 1 illustrates an environment within which memory in accordance withembodiments described herein may be used. In particular, FIG. 1illustrates a computing system 100 that may utilize memory in accordancewith embodiments described herein. The computing system 100 may beillustrative of, for example, a laptop, a desktop computer, a computerwithin a node of several computers, a cell phone, a tablet, or any othercomputing system that may utilize memory in accordance with embodimentsdescribed herein. In particular various components in the illustrativecomputing system 100 may use memory in accordance with embodimentsdescribed herein. The computer system 100 comprises an integratedcircuit (IC) 102 and one or more memory 104 coupled to IC 102, where oneor more memory 104 may comprise memory in accordance with embodimentsdescribed herein.

IC 102 represents any computing element present in a system. Forexample, IC 102 may be a central processing unit (CPU), a processingelement, a graphics processing unit (GPU), hardware accelerator, systemon a chip (SOC), digital signals processor (DSP), a machine learningunit, a matrix operations unit (MOU), etc. In some embodiments, IC 102may comprise memory in accordance with embodiments described herein.

For example, IC 102 may comprise L3 cache memory in accordance withembodiments described herein. Additionally, memory in accordance withembodiments described herein, may be used as part of a computationprocess such as in the GPU, and in various chips such as the MOUtailored for machine learning. A MOU may perform matrix transpose andtransformation operations. The MOU may also perform matrix arithmetic.

Additionally, IC 102 and one or more memory 104 may be coupled tostorage device 106, and a network interface device 108. In someembodiments, the storage device 106 may comprise a hard drive, solidstate disk, memory stick, optical disc, etc. The storage device 106 maycomprise a non-transitory computer readable storage medium on whichprograms executable by IC 102 may be stored and accessed when needed byIC 102. Storage device 106 is not restricted to being comprised of onlyone type of memory. For example, in some embodiments, storage device 106may comprise memory 106 a and memory 106 b used as a buffer for a solidstate disk (storage device 106). Memory 106 a may be a buffer for memory106 b which is a buffer for storage device 106.

Programs stored on the storage device 106 may comprise programs toimplement various processes on the computer system 100. In some cases,the programs are copied from the storage device 106 to the memory 104,and the programs are executed from the memory 104. Thus, both the memory104 and storage device 106 shall be considered computer-readable storagemediums.

In various embodiments, network interface device 108 may allow computersystem 100 to exchange data over a wireless or wired network. In someembodiments, the computer system 100 may be connected to a plurality ofother computers within a shared network.

Additionally, although a computing system 100 has been described toillustrate an environment in which memory in accordance with embodimentsdescribed herein may be present, embodiments of memory discussed hereinare not limited to this specific environment. For example, memory inaccordance with embodiments discussed herein may be used in vehicles,internet appliances, wireless local area network (LAN) hardware,switches, network interface devices, audio players, flash storage cards,televisions, cameras, video recorders, etc.

Turning now to FIG. 2, features of various memory in accordance withvarious embodiments of memory described herein are discussed. Where thememory described herein may be used, for example, in IC 102, memory 104or storage device 106 are discussed. In particular, block diagrams 201,203, and 205 illustrate a one transistor (1T) DRAM cell, a twotransistor (2T) DRAM cell, and a three transistor (3T) DRAM cell,respectively. In each memory cell, a value V_(data) is stored in astorage node either as a logical 0 (“0”) or a logical 1 (“1”). Valuesfor V_(data) are shown in graph 207.

The 1T DRAM memory cell 201, comprises a transistor 209 connected inseries with a capacitor 211. A gate terminal of the transistor 209 isconnected to a word line (WL) 213, while a source or drain terminal ofthe transistor 209 is connected to the bit line (BL) 215.

The 1T DRAM memory cell 201 stores data V_(data) at a storage nodebetween the transistor 209 and capacitor 211. During operation, BL 215is charged to a level V/2 and during a read operation, the voltage ofthe BL 215 will change by delta V (i.e., ΔV). That is, during a readoperation, the voltage of BL 215 will either increase or decreaserelative to V/2 by an amount ΔV, indicating the logical value stored inthe memory cell. Characteristics of WL 213, and the BL 215 of the 1TDRAM memory cell 201 during a read operation are illustrated by linegraphs 217 and 219.

In particular, line graph 217 illustrates voltage values of the WL 213during a read operation, and line graph 219 illustrates voltage valuesof the BL 219 during the same read operation. At time t₁, the voltagelevel of the word line 213 increases. After a time delay, at asubsequent time t₂, the voltage level of the BL 219 begins to eitherincrease or decrease, depending on the logical value stored in thememory cell. At time t₃, the voltage value of BL 315 reaches a thresholdvoltage value sufficient to be processed and interpreted as a logical“0” or “1”.

A 2T DRAM memory cell 203 comprises two transistors 221 and 223 where adrain terminal of transistor 221 is connected to the gate terminal ofthe transistor 223. V_(data) is also stored at a storage node comprisinga connection between transistor 221 and transistor 223. A write wordline 225 is connected to the gate terminal of transistor 221, while awrite bit line 227 is connected to the source terminal of transistor221. The source and drain terminals of transistor 223 are connected toread bit line 229 and read word line 231.

Of note, the source and drain terminals in any NMOS transistor discussedherein are interchangeable. Accordingly, if one example describes aconfiguration identifying a source and drain terminal, embodiments inwhich the source and drain terminal designations are switched are alsocontemplated. Furthermore, embodiments described herein are inaccordance with implementations using NMOS transistors. Implementationsusing PMOS transistors are also contemplated and descriptionscomplementary to those provided herein as also contemplated.

Depicted in line graph 233, the voltage levels on read word line 231during a read operation are shown and corresponding voltage level onread bit line 229 are shown in line graph 235. Initially, at time t₄,the voltage levels of the read word line 231 and read bit line 229 are“high”, or some value above 0V.

In relation to voltages present at the terminals of a transistor, a“high” value may correspond to a logical “1” value. A “high” value maycorrespond to a “VDD” voltage value. A “low” value as referenced herein,may correspond to a voltage value that introduces a potential differencebetween a “high” value sufficient to keep a transistor off. The “high”value may be present at a drain terminal, while the “low” value ispresent at the source terminal of a transistor. In one example, the“low” value may be any voltage value that is lower than the “high” valueby a threshold voltage amount, where the threshold voltage defines theminimum potential difference (voltage) needed between two terminals tokeep a transistor off. Thus, a “low” value is not necessarily zero,although it may be zero in some embodiments.

Continuing the discussion of line graph 233, subsequent to time t₄,during a read operation, the read word line voltage level is droppedbelow the initial “high” value. At time t₅, the read word line voltagelevel reaches a “low” level. After a time delay and subsequent to timet₅, the read bit line voltage level may remain unchanged (stay “high”)or begin changing to a “low” level (time t₆) depending on the value ofV_(data). Whether or not the read bit line voltage level stays the sameor shifts indicates the value of V_(data) stored in the memory cell. Attime t₇, the read word line voltage level is returned to the initial“high” level.

A 3T DRAM memory cell 205 comprises three transistors 237, 239, and 241.Two transistors 239 and 241 are connected in series while a drainterminal of transistor 237 is connected to a gate terminal of transistor239. V_(data) is stored at the node where the drain terminal oftransistor 237 is connected to the gate terminal of transistor 239. Asource terminal of transistor 237 is connected to a write bit line 243,while a write word line 245 is connected to a gate terminal oftransistor 237. A read word line 247 is connected to a gate terminal oftransistor 241, while a drain terminal of transistor 241 is connected toa read bit line 249.

Depicted in line graph 251, the voltage levels on read word line 247during a read operation are shown and corresponding voltage levels onread bit line 253 are shown in line graph 253. Initially at time t₈, theread word line voltage level starts out “low” while the read bit linevoltage level starts out “high.” During a read operation at time t₉, thevoltage level on read word line 251 is increased. Subsequently after atime delay, at time t₁₀, depending on the value stored as V_(data), thevoltage level of read bit line 249 will remain unchanged or drop. Attime t₁₁, the voltage level on the read word line 247 is returned to a“low” level.

As illustrated in line graphs 219, 235, and 253, changes in voltages onthe read bit lines are gradual and occur after a time delay. The rate ofchange of the voltage may vary based on characteristics of a transistorand an amount of voltage on the gate terminal. Additionally, the amountof voltage on the gate terminal also correlates to the amount of currentthat will flow through the transistor.

Turning now to FIG. 3, current voltage characteristics of a transistoras well as a block diagram of a transistor are described. Current flowshown in transistor 303 is shown using conventional flow notation, asopposed to electron flow notation. In particular, the amount of voltageapplied at a gate terminal 301 of transistor 303 may determine theamount of current 305 flowing through the transistor. The followingcharacteristics as discussed in graph 305 of transistor 303 may be usedto store multiple values in a single memory cell as described herein.

In the various configurations of a DRAM memory cell, discussed in FIG.2, a read bit line (e.g., 215, 229, 249) is connected to a drain orsource terminal of a transistor. Transistor 303 may represent any of thetransistors 209, 223, and 241, where a read bit line is connected to adrain terminal 309. When a sufficient gate voltage 311 is applied togate terminal 301, to turn on transistor 303, current 307 begins to flowfrom the drain terminal 309 to the source terminal 313.

As mentioned previously, the source and drain terminals of a typicalnegative-channel metal-oxide (NMOS) transistor, such as transistor 303,are interchangeable. The source and drain terminals may be referred toas conduction electrodes. Given a sufficient voltage such as a voltageamount greater than a threshold voltage amount is applied at gateterminal 301, current will flow between the conduction electrodes basedon whether one conduction electrode is at a lower potential in relationto the other conduction electrode. In an example scenario wheresufficient voltage is applied to gate terminal 301, if no potentialdifference is present between the conduction electrodes, current willnot flow between the conduction electrodes.

In application, a source or drain designation assigned to a respectiveconduction electrode may reflect a given state of the transistor and thedirection of current flow between two conduction electrodes. In somescenarios, the drain terminal is at a higher potential than the sourceterminal. However, the source and drain designations assigned withinthis document are not meant to imply a direction of current flow for agiven example described herein. To ease discussion, in the examplesdiscussed herein, one conduction electrode of a transistor has beenlabeled a drain terminal and the other terminal labeled a sourceterminal. For a given example where respective conduction electrodeshave been designated as source and drain, embodiments where the sourceand drain designations are switched from what is described herein, arecontemplated as well.

Continuing the discussion of transistor 303, as a read bit line (e.g.,215, 229, or 249) is connected to a drain or source terminal, thecurrent flowing between the drain and source terminals of a transistor(e.g., transistor 209, 223, 239, 241) may correspond to a bit linedischarging. The amount of voltage 311 applied at a gate terminal of atransistor with respect to a source terminal or the amount of voltage311 applied at a source terminal of a transistor with respect to a gateterminal may also determine the amount of time taken and the rate ofdischarge, of a bit line for example. For example, in a 1T or 3T DRAMcell, a voltage is applied at a gate terminal with respect to a sourceterminal. In a 2T DRAM cell, voltage is applied at a source terminalwith respect to a gate terminal. Accordingly, based on a measured timedelay for a bit line to discharge, the multiple values may be measuredand detected.

In graph 305, the x-axis represents voltage values across the source anddrain terminals (313 and 309, respectively) of transistor 303, while they-axis represents an amount of current 307 flowing between the sourceand drain terminals (313 and 309). In graph 305, the different V_(GS)curves (e.g., 317, 316, 318, and 325), represent different voltageamounts V_(GS) applied at gate terminal 301 and corresponding current(i_(DS)) and voltage (V_(DS)) characteristics for each V_(GS).

As shown by the different V_(GS) curves, different voltage amountsapplied to gate terminal 301 may determine an amount of current flowingthrough transistor 303 and an amount of voltage measured across thesource and drain terminals (313 and 309). For example V_(GS) curve 317depicts the amount of current that may flow through transistor 303, fora particular V_(GS) level 315 and as the voltage across the source anddrain terminals is increased (V_(DS)).

Each V_(GS) voltage level is set above the threshold voltage (V_(th)) byan amount defined as the overdrive voltage (e.g., V_(OV1)), whereV_(OV6) represents an amount greater than V_(OV0). Accordingly, theV_(GS) level equaling the threshold voltage plus V_(OV6) is greater thanthe V_(GS) level equaling the threshold voltage plus V_(OV0). For agiven V_(GS) level, the amount of current flowing through the transistor303 increases as V_(DS) is increased initially (linear region ofoperation 321).

After some value of V_(DS) is reached, for each V_(GS) curve, additionalincreases in V_(DS) do not substantially impact the current (i_(DS))flowing through transistor 303 and the transistor is considered to beoperating in a saturation region of operation 319. Changes in V_(DS)have more influence on the current flowing through transistor 303 in thelinear region of operation 321. For each V_(GS) curve, the transitionbetween modes of operation from the linear region of operation 321 tothe saturation region of operation 319 is marked by dashed line 327.

As shown in graph 305, i_(DS) is a function of the overdrive voltage(V_(OV)), which is the amount by which the gate-to-source voltage(V_(GS)) exceeds the threshold voltage (V_(th)). In particular, as shownin column 323, taking curve 317 as an example:i _(DS) =K′(V _(OV0))²  (1)where K′ is a parameter further representing technology and deviceparameter constants of the transistor, more specifically:K′=μ _(n) C _(ox)(W/L)  (2)where μ_(n) represents surface mobility, C_(ox) represents gate oxidecapacitance per unit area, W is a width of the transistor, and Lrepresents a length of the transistor.

Based on the V_(GS) value applied at the gate terminal 311, transistor303 may behave differently and according to the various V_(GS) curves(i.e., curves 316, 317, 318, and 325) shown in graph 305. Thus,transistor 303 may operate as a variable resistor, where the amount andrate of change of i_(DS) (in the linear region of operation 321) isdifferent for each curve. In particular, during a given read operation,where a read bit line is connected to a source or drain of transistor303, the value of the gate voltage (V_(GS)) dictates the i_(DS) vs.V_(DS) curve that is representative of the amount of i_(DS) flowingthrough transistor 303. The value of the gate voltage (V_(GS)) maydetermine the rate at which a read line may discharge. In variousembodiments, a measure of the time taken to discharge a read bit linemay be used to determine a particular voltage or value that is stored ina memory cell.

Turning now to FIG. 4, a memory cell in accordance with variousembodiments is discussed. The rate at which a voltage change occurs maybe used to discern the value stored within the memory cell. Taking athree transistor (3T) DRAM cell (205) as an example, a method forstoring multiple values in the memory cell is described.

In this example, eight logical values 0-7 for V_(data), represented inbinary nomenclature in graph 403 may be programmed into the 3T DRAM cell205. In graph 403, a voltage value is represented along the x-axis. Eachlogical value is stored as a different voltage value.

For example, the logical value “0” may be stored as a voltage valuearound zero volts, the logical value “1” may be stored approximately asa voltage value “V₁”. The logical value “2” may be stored approximatelyas voltage value “V₂” where the value of “V₂” is higher than “V₁”, andthe remaining logical values may be programmed accordingly wheresuccessive logical values are programmed as increasingly larger voltagevalues.

During operation of the 3T DRAM cell 205, the voltage value representingeach logical value may not be exactly zero or “V₁”, “V₂”, etc. Instead,the voltage value may be within some voltage value above or below thetargeted voltage values of zero, “V₁”, “V₂”, for example. Accordingly,voltage values that may register as a particular logical value arerepresented as an individual bell curve in graph 403. Each bell curvecaptures a potential distribution of voltage values that may correspondto a respective logical value.

The manner in which the voltage values are assigned to representdifferent logical values is not limited to this example and otherassigning schemes may be used. That is, the assignment scheme between avoltage value and a corresponding logical value is discussed for thepurpose of illustrating an embodiment and is not meant to be limiting ofthe type of assigning scheme that may be used. For example, the logicalvalue “0” may be stored as a voltage value “0” while the logical value“7” is stored as a voltage value “V₇”. Graph 403 captures one exampleway in which different voltage values may be used to represent differentlogical values. Additionally, any assigning scheme discussed in thedocument is considered an example and shall not constitute a limitingexample.

During a read operation of the 3T DRAM cell 205, at time t⁻¹, a clockmay go high, as represented in line graph 405. Next at time t_(−0.5),the read word line (RWL) goes high. Subsequently, the amount of i_(DS)flowing through transistor 239 and the rate of change of i_(DS) dependson the voltage value of V_(data) 401. Finally, a strobe clock of aplurality of strobe clocks may go high in response to a voltage level ofa bit line falling below a threshold voltage level V_(REF) 409.

The manner and rate at which the bit line discharges depends on thevoltage value of V_(data) 401, where V_(data) 401 is stored at a storagenode. Recall the different V_(GS) curves shown in graph 305 fordifferent values of V_(GS). The higher voltage value of V_(GS) (curve325) would correspond to a faster discharge rate of the bit line than alower voltage value of V_(GS), such as curve 317. That is, if a voltagevalue of “V₇” is stored as V_(data), (in this example “V₇” may followthe curve represented by curve 325 in graph 305), the discharge mayoccur at time t₀ (407). As “V₇” may follow the curve 325 (graph 305),the discharge may occur sooner than the other V_(GS) curves in graph305.

In detecting a bit line discharge, the bit line is consideredsufficiently discharged after it has reached a predetermined thresholdamount such as a voltage level equal to V_(REF) 409. Various circuitrymay be used to assess the voltage level of the bit line and make adetermination as to whether the bit line has sufficiently discharged.For example, a voltage comparator may be utilized to compare the bitline to a reference voltage, such as a reference voltage provided by abandgap reference circuit, or other reference voltage. In anotherexample, a “skewed” inverter having a higher than usual trip point maybe utilized. Such a skewed inverter may be implemented by sizing thePMOS transistor to be stronger than the NMOS transistor.

In some embodiments, a strobe clock may be programmed to fire during apredefined time window, where an indicator is captured during thepredefined time window. The indicator may be produced by the variouscircuitry used to assess the voltage level of the bit line. In someembodiments, the various circuitry may comprise a comparator, circuitrycapable of capturing a voltage level of the bit line, etc. Thus theindicator may comprise various forms. For example, the indicator may bea value output by the comparator, or the value may reflect the voltagevalue of the bit line. Overall, the indicator contains data that may beused to determine whether a voltage level of the bit line has fallenbelow a predetermined threshold amount.

In one example, the strobe clock denoted STRCLK₀ captures an indicatorat a predefined time window or time interval around time t₀. In theexample shown in graph 405, a plurality of strobe clocks may be set tofire at or around different predefined time windows. For example, ingraph 405, up to seven strobe clocks may be set to fire at differentpredefined time windows or time intervals. Based on the strobe clockthat captures an indicator with data that the bit line has fallen belowthe predetermined threshold voltage value during a read operation, adetermination may be made as to the voltage value of V_(data) 401, andin turn correlated to a logical value.

In this example with seven strobe clocks, the earliest strobe clock ofthe seven that captures the indicator with data that the bit line hasfallen below the predetermined threshold may be used to determine thelogical value. In some embodiments, a subset of the plurality of strobeclocks may be set to fire. Thus not all seven strobe clocks may fireduring a given read operation.

In another example, if a voltage value of “V₇” is stored in V_(data)401, STRCLK₀ is set to fire (e.g., switch to a high state) in a timewindow spanning from prior to time t₀ and in between time t₀ and timet₁. Since V_(data) 401 stores a voltage value of “V₇”, the voltage valueof the bit line will have fallen below V_(REF) 409. Thus, the indicatorcaptured by STRCLK₀ will reflect that the bit line has fallen belowV_(REF) 409.

In another example, if V_(data) is a voltage value of “V₆” with avoltage level lower than the voltage value of “V₇”, the “V₆” voltagelevel may take longer to discharge the bit line than if “V₇” were storedas V_(data). Accordingly, the bit line may discharge around time t₁subsequent to time t₀.

In this example, STRCLK₀ will fire (e.g., switch to a high state) in thetime window spanning from prior to time t₀ and in between time t₀ andtime t₁. However, the indicator captured by STRCLK₀ will reflect thatthe bit line has not fallen below V_(REF) 409. STRCLK₁ will fire (e.g.,switch to a high state) in the time window spanning from prior to timet₁ and in between time t₁ and time t₂. As the voltage value of RBL 249will fall below V_(REF) 409 around the time STRCLK₁ is set to fire, whenSTRCLK₁ fires, the indicator captured when STRCLK₁ fires will reflectthat the bit line has fallen below V_(REF) 409.

Overall, the lower the voltage level of a stored V_(data), the longer itmay take a bit line to discharge. Accordingly, in the example providedin FIG. 4, V_(data) 401 with a voltage level of “V₇” will experience abit line that is sufficiently discharged, or a bit line that has reacheda voltage level of V_(REF) 409, around time t₀. V_(data) 401 with avoltage level of “V₆” will experience a bit line that is sufficientlydischarged, or a bit line that has reached a voltage level of V_(REF)around time t₁. V_(data) 401 with a voltage level of “V₅” willexperience a bit line that is sufficiently discharged, or a bit linethat has reached a voltage level of V_(REF) 409 around time t₂. V_(data)401 with a voltage level of “V₄” will experience a bit line that issufficiently discharged, or a bit line that has reached a voltage levelof V_(REF) 409 around time t₃, so on and so forth. For the case whereV_(data) 401 is equal to zero volts, the read bit line will continue tostay high. Accordingly, a read bit line that continues to stay high fora set time quantity may indicate that V_(data) 401 is equal to zerovolts.

As briefly mentioned previously, in order to detect the span of timetaken by the bit line to sufficiently discharge, or has reached avoltage level of V_(REF) 409, a plurality of strobe clocks may becoupled to the bit line. Each of the plurality of strobe clocks is setto fire at different time windows and cause surrounding circuitry tostrobe the bit line or a comparator connected to the bit line todetermine whether sufficient discharge has occurred. Upon detecting thata bit line voltage has fallen below the predetermined voltage level(V_(REF) 409), the corresponding strobe clock may dictate the timewindow within which an indicator is captured. Based on the specificstrobe clock that captures an indicator reflecting that the bit line hasfallen below a predetermined threshold amount, surrounding circuitry maydetermine the span of time the bit line has taken to discharge to thevoltage amount of V_(REF) 409.

Whether or not sufficient discharge has occurred may be determined byany known method in art. For example, a determination may be made thatsufficient discharge has occurred by checking a state of a comparatorconnected to read bit line 249. The voltage level of the read bit line249 may be compared to a predetermined threshold amount such as V_(REF)409 voltage to assess whether read bit line 249 has discharged asufficient amount.

Based on a length of time taken for a bit line to dischargesufficiently, surrounding circuitry may determine the voltage value ofV_(data) stored in the memory cell, which in turn is correlated to alogical value. In the situation where V_(data) is equal to zero volts,the surrounding circuitry may determine V_(data) is zero volts afterdetecting the bit line remains high for a time quantity that is greaterthan a predetermined threshold amount of time. The concept ofcorrelating a time window for discharge to a voltage value and in turn alogical value may be applied to other types of memory cells such as a 2Tor 1T DRAM cell.

Turning now to FIG. 5, a two transistor (2T) DRAM cell capable ofstoring multiple values is described. As described previously, a 2T DRAMcell 203 comprises transistors 221 and 223, where a drain terminal oftransistor 221 is connected to the gate terminal of transistor 223. Thegate terminal of transistor 221 is connected to a write word line WWL225, while a source terminal of transistor 221 is connected to write bitline WBL 227. The drain terminal of transistor 223 is connected to readbit line 229, while the source terminal of the transistor 223 isconnected to read word line 231. The labeling of the source and drainterminals continues to be for the ease of discussion of this example;these terminals are interchangeable. V_(data) 501 is stored at a storagenode comprising a connection between transistor 221 and transistor 223.

During operation of the 2T DRAM cell 203, RBL 229 and RWL 231 areprecharged to a high voltage value, for example VDD. To understand themechanism of detecting the logical value stored in the 2T DRAM cell 203,note that both the source and drain terminals for transistor 223 are atthe same level, and charge will not flow between terminals even whentransistor 223 is turned on, for example by a voltage applied to thegate terminal (V_(data)>0). Creating a difference in voltage between thegate and source terminals of transistor 223 causes current to flowthrough transistor 223 given a sufficient voltage or V_(data) 501voltage value is present between the gate terminal and the sourceterminal of transistor 223.

This characteristic may be utilized to read the voltage value ofV_(data) stored in a storage node in memory cell 203. In one embodiment,a difference in voltage between the RBL 229 and RWL 231 is incrementallycreated to determine the voltage value of V_(data) 501. That is, thevoltage value of RWL 231 may be incrementally reduced and the incrementduring which RBL 229 is sufficiently discharged may be correlated to astored voltage value of V_(data) 501, which in turn may correspond to arespective logical value.

The incrementally reduced voltage at RWL 231 increases the voltagebetween the gate terminal and source terminal of the transistor 223.Depending on the V_(data) 501 voltage stored at the gate terminal of thetransistor 223, the transistor 223 may turn ON when the RWL 231 isincrementally reduced to be lower than the threshold voltage of thetransistor 223 with respect to the V_(data) 501 at the gate terminal ofthe transistor 223.

Similar to the 3T DRAM cell, 2T DRAM cell 203 may store different valuesof V_(data) 501, where V_(data) 501 may be zero volts, “V₁”, “V₂”, . . .“V₇”. The different voltage levels that may be programmed as V_(data)501 in memory cell 203, may each represent logical values 0-7,represented in binary nomenclature in graph 503. For example, V_(data)501 having a voltage value around zero volts may correspond to thelogical value “0”, V_(data) 501 having a voltage value around “V₁” maycorrespond to the logical value “1”, V_(data) 501 having a voltage valuearound “V₂” may correspond to the logical value “2”, etc.

Similar to operation of the 3T DRAM cell, during operation of the 2TDRAM cell 203, the voltage values representing each logical value aretarget voltage values, where actual voltage values that may beinterpreted as corresponding logical values, comprise a spread ofvoltage value greater than and less than a given target voltage value.Accordingly, graph 503 illustrates voltage values that may register as aparticular logical value as a bell curve that captures a potentialdistribution of voltage values that may correspond to a respectivelogical value.

During a read operation of the 2T DRAM cell 203, the voltage of RWL 231may be incrementally lowered, as shown in graph 519. In graph 519, thex-axis represents time, while the y-axis represents voltage values. AsRWL 231 is initially charged high, the voltage of RWL 231 may be atlevel 521, and subsequently, the voltage of RWL 231 may be lowered tolevel 523. The voltage of RWL 231, continues to be lowered incrementallyat certain time increments, to levels 525, 527, 529, 531, 533, and 535.

For a given voltage value of V_(data) 501, corresponding to voltage atthe gate terminal of transistor 223, once the voltage difference betweenV_(data) 501 stored at the gate terminal and RWL 231 surpasses thethreshold voltage amount or a voltage amount sufficient to turn ontransistor 223, RBL 229 may begin discharging. Further, given asufficient amount of voltage difference is present between RBL 229 andRWL 231, the rate at which RBL 229 discharges and whether or not RBL 229discharges at all depends on the voltage value of V_(data) 501. Forexample, a higher V_(data) voltage level will result in RBL 229discharging for a higher voltage at RWL 231 (i.e., a smaller decrementalvoltage value 539, 541, 543, etc.) than will a lower V_(data) voltagelevel.

Furthermore, the voltage level to which RBL 229 discharges will dependon the voltage level of RWL 231. For example, in the case where RBL 229discharges after the voltage level of RWL 231 is lowered a single timeto level 523, the voltage level of RBL 229 will lower until it equalsthe voltage level of RWL 231. Thus, in graphs 519 and 555, the voltagelevels 523 and 539 are about the same.

Graphs 519 and 555 demonstrate example voltage levels of RWL 231 and RBL229 respectively during a read operation of the 2T DRAM cell 203. Line521 represents a voltage level of RWL 231 during a read operation, whileline 537 describes a voltage level of RBL 229. Further, the dashed line561 in graph 537 represents a predetermined voltage level, such asV_(REF), used to determine whether RBL 537 has discharged sufficiently.

In various embodiments, the different voltage levels 523, 525, 527, 529,531, 533, and 535 of RWL 231 may be referred to as steps. The number oftimes the voltage level of RWL 231 has been stepped down before a RBL229 begins to discharge may be assessed to determine the value ofV_(data) 501.

In an example, where V_(data) 501 stores a voltage value of “V₇”, where“V₇” is a higher voltage value than “V₆”, “V₅”, “V₄”, “V₃”, “V₂”, and“V₁”, RBL 229 may begin to discharge after the voltage level of RWL 231is lowered to level 523. Accordingly, by time t₀, the voltage level ofRBL 229 may discharge to voltage level 539. Recall voltage level 539 ofRBL 229 will be around voltage level 523 of RWL 231, as when RBL 229begins to discharge, it will continue discharging until the voltagelevel of RBL 229 has reached about the same voltage level of RWL 231.

In an example where V_(data) 501 stores a voltage value of “V₆”, where“V₆” is a lower voltage value than “V₇”, RBL 537 may not discharge afterthe first step down in the voltage level of RWL 231. As “V₆” is a lowervoltage value than “V₇”, a greater difference in voltage between thegate and drain terminals may be needed before transistor 223 beginsconducting (i.e., RBL 229 begins discharging). Accordingly, as shown ingraphs 519 and 537, RBL 229 may begin discharging after the second stepdown (level 525) of voltage on RWL 231.

In an example where V_(data) 501 stores a voltage value of zero volts,RBL 229 will not discharge. That is, when RWL 231 is at voltage level535 the voltage between the gate and source terminal of the transistoris less than the threshold voltage required for turning transistor 223ON.

In some embodiments, the number of times the voltage level of RWL isstepped down may be translated into the voltage value stored as V_(data)501, which is further correlated to a logical value corresponding to thevoltage value of V_(data) 501. For example, if RBL 229 beginsdischarging when RWL 231 is at voltage level 527 (the third step),surrounding circuitry, such as a counter, may store data reflecting thatthe voltage level of RWL 231 has been stepped down three times. Thisdata that the level has been lowered three times may be correlated toV_(data) storing a voltage value of “V₅”, and subsequently converted tological value “101”.

Although an example using a counter has been described to assess howmany times the voltage level of RWL 231 has been lowered, a counter isnot the only method that may be used to assess this information. Othermethods may be used. For example, the voltage levels may be measuredwhere each voltage level corresponds to a particular step and acomparator may be used to determine which step RWL 231 is at. Similar tothe example discussed with regards to the 3T DRAM cell 205, a clock andstrobing technique may be used to assess the voltage value of V_(data)501.

The number of times the voltage level of RWL 231 is stepped down (or upin some situations) may be a preset number of times. If RBL 229 does notdischarge during the preset number of times RWL 231 is stepped down, aconclusion may be made that V_(data) 501 is storing a voltage value ofzero. More generally speaking, the preset number of times may bedetermined by the possible number of values that may be stored asV_(data) 501.

In one embodiment, the preset number of times may be one less than thepossible number of values that may be stored as V_(data) 501. Forexample, the 2T DRAM cell 203 may be programmed to store a possiblenumber of values “n” as V_(data) 501. Accordingly, a preset number oftimes may be equal to “n−1”. If RBL 229 does not begin to dischargeduring the present number of times “n−1” that RWL 231 is stepped down, aconclusion may be made that V_(data) 501 is storing a last possiblevalue stored in V_(data) 501 without introducing any additional voltagesteps on RWL 231.

Another embodiment is envisioned in which the 2T DRAM cell 203 is one ofa plurality of 2T DRAM cells. The plurality of 2T DRAM cells maycomprise a row of memory. If a read operation reads a single memory celland not the remaining cells in the row, as the voltage value of RWL isstepped down in the memory cell of interest, the voltage values of WWLin the surrounding cells may also be stepped down to deter V_(data)voltage values in the other cells from discharging through a bit line.In other words, in an unselected memory cell on unselected row, theselected RBL node, as its voltage decreases, can act as a sourceterminal for the unselected 2T DRAM cell, while the unselected RWL atVDD can act as a drain terminal for the unselected 2T DRAM cell.

Turning now to FIG. 6, a concept of charge sharing is described. Thisconcept applies to the description of a one transistor (1T) DRAM cell,as described in FIG. 7. Block diagram 601 illustrates a transistor 623with a gate terminal 631, and source and drain terminals connected tocapacitors 621 and 625, respectively. Gate terminal 631 has a voltagevalue of V_(G). Capacitor 621 holds a charge and respective voltageamount V₀, while capacitor 625 holds a charge and respective voltageamount V₁.

Transistor 623 is off when the V₀ voltage and the V₁ voltage are bothgreater than V_(G)−V_(th), where V_(th) is a threshold voltage fortransistor 623 (block diagram 603). Transistor 601 may turn on wheneither the source or drain terminals (conduction electrodes) is lowerthan the gate terminal (control electrode) by a threshold voltage amount(block diagram 605). Recall, a potential difference between theconduction electrodes is also present in the case where current isflowing between the conduction electrodes. Once the voltage differencebetween the gate electrode and both conduction electrodes no longerexceeds the threshold voltage of the transistor, the transistor willturn off (i.e., will no longer conduct).

Turning now to FIG. 7, a 1T DRAM cell capable of storing multiple valuesis described. As described previously, a 1T DRAM cell 201 comprises atransistor 201 and capacitor 211. The gate terminal of transistor 209 isconnected to word line (WL) 213 while a source or drain terminal oftransistor 209 is connected to bit line (BL) 215. The source or drainterminal not connected to BL 215 is connected to capacitor 211, andV_(data) is stored at the storage node comprising the connection betweentransistor 209 and capacitor 211.

In this example, eight logical values 0-7 for V_(data) are representedin binary nomenclature in graph 711. These eight logical values may beprogrammed into the 1T DRAM cell 201 as a respective voltage valuerepresented along the x-axis. As shown in graph 711, each logical valueis stored as a different voltage value.

For example, the logical value “0” may be stored as a voltage valuearound zero volts, the logical value “1” may be stored approximately asa voltage value “V₁”. The logical value “2” may be stored approximatelyas voltage value “V₂” where the value of “V₂” is higher than zero volts,and “V₁” and the remaining logical values may be programmed accordinglywhere successive logical values are programmed as increasingly largervoltage values.

During operation of the 1T DRAM cell 201, the voltage value representingeach logical value may not be exactly zero or “V₁”, “V₂”, etc. Instead,the voltage value may be within some voltage value above or below thetargeted voltage values of zero, “V₁”, “V₂”, for example. Accordingly,voltage values that may register as a particular logical value arerepresented as an individual bell curve in graph 711. Each bell curvecaptures a potential distribution of voltage values that may correspondto a respective logical value. The manner in which the voltage valuesare assigned to represent different logical values is not limited tothis example and other assigning schemes may be used.

During a read operation of the 1T DRAM cell 201, BL 215 is charged highwhile WL 213 is low. The voltage value of WL 213 is incrementallystepped up to determine the voltage value of V_(data) 745. BL 215 willdischarge (toward ground through transistor 209 and capacitor 211) whenWL 213 sufficiently turns on transistor 209 as shown in graphs 709 and747. In graph 709, example voltage values during a read operation of WL213 are shown, where voltage values increase as the y-value increases.In graph 747, possible voltage values during a read operation of BL 215are shown, where voltage values increase as the y-value increases.

In a 1T DRAM cell 201, charge sharing applies between BL 215 andcapacitor 211. Accordingly, as the voltage value of WL 213 isincrementally stepped up to a respective voltage that is a predeterminedamount higher than each possible voltage value of V_(data) 745, when thevoltage value of V_(data) 745 is first exceeded by the voltage of the WL213 (less a threshold voltage), the BL 215 will initially discharge toaround the same voltage value irrespective of the V_(data) 745 voltage,since the same amount of charge is initially coupled from the cell 201into the BL 215 (at which point the access transistor 209 turns off).Accordingly, the different scenarios in which BL 215 discharges arerepresented by voltage values that level off at around the same initialvalue (e.g., voltages 731, 733, 735, etc.). Further the dashed line 749in graph 747 represents a predetermined voltage level, such as V_(REF),used to determine whether BL 215 has discharged sufficiently. After theaccess transistor 209 is first turned on, and as the WL 213 isincremented to even higher voltages, additional charge is coupled fromthe memory cell 201 into the BL 215, and the voltage of the BL 215decreases further (e.g., see FIG. 13).

Similar to a read operation of the 2T DRAM cell 203, during a readoperation of the 1T DRAM cell 201, the voltage of WL 213 isincrementally stepped. Instead of being lowered, however, the voltagevalue of WL 213 may be incrementally increased. The different voltagelevels 713, 715, 717, 719, 721, 723, 725, and 727 of WL 213 may bereferred to as steps. The number of times the voltage level of WL 213has been stepped up before BL 215 begins to discharge may be assessed todetermine the value of V_(data) 745.

In an example, where V_(data) 745 stores a voltage value of zero volts,BL 215 may begin to discharge after the voltage level of WL 713 isincreased to level 715. The potential difference between the source anddrain terminals of transistor 209 may be greatest when V_(data) 745stores zero volts, and thus a small increase in the voltage level of WL213 may be sufficient to turn on transistor 209 as the source terminalof transistor 209 is at zero voltage and gate terminal connected to WL213 is at a potential higher than the threshold voltage required to turnON the transistor 209. Accordingly, when V_(data) 745 stores zero volts,by time t₀, the voltage level of BL 215 may discharge to voltage level731.

The voltage level of WL 213 at step 715 may be greater than the voltagevalue of V_(data) 745 by at least a threshold voltage amount. Todemonstrate this difference, the various possible voltage values ofV_(data) 745 in relation to voltage level of WL 213 is shown in graph709.

In an example where V_(data) 745 stores a voltage value of “V₁”, BL 215may begin to discharge after the voltage level of WL 213 isincrementally stepped to the second level 717. Each successive voltagevalue that may be stored as V_(data) 745 may be detected with successivesteps in the voltage level of WL 213. In an example where V_(data) 745stores a voltage value of “V₇”, BL 215 may not discharge during theincremental changes in the voltage level of WL 213. In this example, ifBL 215 does not begin discharging after seven incremental increases inthe voltage level of WL 213, surrounding circuitry may conclude thatV_(data) 745 is storing a voltage level “V₇”.

The number of times the voltage level of WL 213 is stepped up may betranslated to a voltage value stored as V_(data) 745, which is furthercorrelated to a logical value corresponding to the voltage value ofV_(data) 745. For example, if BL 215 begins discharging when WL 213 isat voltage level 721 (the fourth step), surrounding circuitry, such as acounter, may store data reflecting that the voltage level of WL 213 hasbeen stepped up four times. The data that the level has been stepped upfour times may be correlated to V_(data) storing a voltage value of“V₃”, and subsequently converted to logical value “011”.

Although an example using a counter has been described to assess howmany times the voltage level of WL 213 has been stepped up, a counter isnot the only method that may be used to assess this information. Othermethods may be used. For example, the voltage levels may be measuredwhere each voltage level corresponds to a particular step and acomparator may be used to determine which step WL 213 is at. Similar tothe example discussed with regards to the 3T DRAM cell 205, a clock andstrobing technique may be used to assess the voltage value of V_(data)745.

Similar to a read operation of the 2T DRAM cell 203, the number of timesthe voltage level of WL 213 is stepped up or down may be a preset numberof times. If BL 215 does not discharge during the preset number of timesWL 213 is stepped up or down, a conclusion may be made that the V_(data)745 is storing a last possible value.

For example, the 1T DRAM memory cell 201 may be programmed to store apossible number of values “n” as V_(data) 745. After stepping through apreset number of times, n−1, without detecting BL 215 beginning todischarge, a conclusion may be drawn that the data stored in V_(data)745 is the last possible value, without introducing any additionalvoltage steps on WL 213. Avoiding stepping up to one more voltage levelhelps save power.

Turning now to FIG. 8, a block diagram illustrates an example circuitconfiguration that may utilize the embodiments discussed herein. Diagram801 comprises two transistors 811 and 813 connected in series, where asource or drain terminal of transistor 811 is coupled to a read bit line(RBL) 815. The gate terminal of transistor 811 is coupled to read wordline (RWL) 817. V_(data) 807 is stored on a storage node comprising thegate terminal of transistor 813.

A circuit configuration such as shown in diagram 801 may be found invarious circuits, such as the 3T DRAM memory cell (FIG. 2, transistors241 and 239). To determine the voltage value of V_(data) 807, inaccordance with various embodiments, RWL 817 may be precharged to a highvalue.

V_(data) 807 may represent more than two possible logical values, wherethe logical values are stored as different voltage values. Graph 803demonstrates one example correlation between different voltage valuesthat may be stored as V_(data) 807, and logical values corresponding torespective voltage values.

The voltage value may be determined using any method previouslydescribed, including strobing or implementing voltage steps. Anothermethod for determining the voltage value of V_(data) may check a voltagelevel of RBL 815 at a predetermined time interval and correlate thevoltage level of RBL 815 during the predetermined time interval to alogical value represented by V_(data).

Graph 805 illustrates the voltage levels of a clock (CLK), RWL 817, andRBL 815, during a method performed in accordance with this embodiment.At time t⁻¹, a clock may go high, subsequently, at time t_(−0.5), RWL817 goes high. Due to the semiconductor device physics explainedpreviously (FIG. 3), RBL 815 will begin to discharge at different ratesbased on the voltage value of V_(data) 807.

Thus, at a predetermined time interval, such as at time t₀, the voltagelevel of RBL 815 will be at different levels based on the voltage valueof V_(data) 807. The possible discharge curves of RBL 815 is shown ingraph 805. The predetermined time interval may be set at such a locationwhere a greater difference between the possible voltage curves ispresent. Accordingly, a measured voltage value may more clearly beidentified and more accurately identified.

The measured voltage value of RBL 815 during a time interval t₀ may bemeasured as an analog value that is subsequently converted to a digitalvalue. The digital value may then be correlated to a correspondinglogical value.

Turning now to FIG. 9, a block diagram illustrates another example of acircuit configuration that may utilize the embodiments discussed herein.Diagram 901 comprises three transistors 911, 913, and 915, connected inseries. A source or drain terminal of transistor 911 may be connected toread bit line (RBL) 919. Each gate terminal of transistor 913, and 915may store a voltage value (e.g., V_(g1) and V_(g0)) at a storage node.

Graph 905 demonstrates yet another method of reading the voltage valuesstored as V_(g1) and V_(g0). Of note, the determined voltage value wouldcorrespond to the sum of voltage values V_(g1) and V_(g0). Based on avoltage value stored (e.g., V_(g1) and V_(g0)), the transistors 913 and915 will conduct more or less.

Any method discussed may be used to determine the sum of the voltagevalue stored (e.g., strobing, measuring the voltage level at a giventime). In FIG. 9, a time to discharge method is shown that correlates ameasured delay time to a voltage value. The time delay may be defined asthe time interval between a time t₀, which may correspond to a clockgoing high, and when RBL 919 has reached a predetermined threshold level931. In graph 905, delay times are labeled D₀, D₁, D₂, D₃, D₄, D₅, andD₆. The time delay will vary based on the voltage values of V_(g1) andV_(g2).

Diagram 903 is a circuit diagram that is equivalent to diagram 901.Essentially, transistors 913 and 915 connected in series may be viewedas acting in a manner similar to variable resistors 923 and 925connected in series. Where the total time to discharge of RBL 929 isequivalent to the product of the circuit resistance and the circuitcapacitance.RC time constant=(R ₀ +R ₁)×C _(BL)  (3)Where R₀ and R₁ represent a variable resistance and C_(BL) represents acapacitance of RBL 929. For different values of R₀ and R₁, the RC timeconstant value varies which changes the time delay for discharging. Inequation 3, above, the resistance value of transistor 921 is consideredto be so much smaller than resistances R₀ and R₁ that the resistance oftransistor 921 is negligible. Thus the resistance value of transistor921 is not included in the RC time constant calculation. In embodimentswhere the resistance value of transistor 921 is larger so as not to benegligible, the resistance value may also be included as an offset inthe RC time constant calculation.

The output of RBL 919 in diagram 901 may be coupled to an inverter whichis subsequently coupled to a time to discharge converter (examples ofwhich are described hereinbelow). Accordingly, the delay time may bemeasured and the sum of voltages stored at the gate terminals oftransistors 913 and 915 may be determined.

In graph 907 a method of determining a stored voltage value discussedpreviously is illustrated. In graph 907, the voltage value of RBL 929 ismeasured at time t_(x). Given the different rates of discharge of RBL929, based on the value of the variable resistors, a determination maybe made of the resistance values based on the measured voltage value attime t_(x).

In diagrams 901 and 903, the final sum may result from a large varietyof combinations of values stored in the plurality of transistors. Forexample, several combinations of resistance values R₀ and R₁ may resultin the same sum. The RC delay is the linear combination of all thevariable resistors in series. Further, for a given fixed capacitance thetotal time delay is the linear combination of the resistance in series.Further, if respective resistance values represent logarithmic valuesthen the time delay correlates to the summation of the logarithmicvalues. This is one example in which product terms may be obtained,discussed further in regards to FIG. 10.

The circuits shown in diagrams 901 and 903 may comprise building blocksfor circuits that perform matrix operations of matrix arithmetic. Forexample, the described methods to determine the sum of the voltagesstored at the gates of the transistors connected in series may be usedto add numerical values, where the values of V_(g1) and V_(g0) representnumerical values. Additional operations may be performed, for example,V_(g0) and V_(g1) may represent logarithmic values log(a) and log(b).That is,V _(g0)=log(x) and V _(g1)=log(y)  (4A)

Accordingly, the measured sum of V_(g0) and V_(g1) may represent the logof the product of x and y. Thus, these circuits may be useful fornumerous operations. For example, these circuits may be used to performCartesian addition, vector addition and to solve for a Cartesianproduct. Additionally, circuits shown in block diagrams 901 and 903 maybe biased to perform similar to translinear circuit operations.Transistors are biased in the weak inversion region, a region withinwhich transistors demonstrate exponential current voltagecharacteristics. Thus the transistors biased in the weak inversionregion can perform log−log operation.

Turning now to FIG. 10, various embodiments discussed herein are shownin a configuration that may be used for digital domain signalprocessing. In particular, in block diagram 1001, a plurality oftransistors 1011, . . . , 1013, and 1015 are connected in series.Although three transistors are shown connected in series, diagram 1001may have more transistors connected in series than the three shown. Insome embodiments, block diagram 1001 may include negative-AND-type(NAND-type) non-volatile memory comprising a plurality of transistorsconnected in series.

The gate terminal of transistor 1011 is coupled to enable line 1017 (WLin previous descriptions) that receives an enable signal. The gateterminals of transistors 1013 and 1015 are respectively coupled to wirestransmitting signals 1007 (V_(g1)) and 1009 (V_(g0)) in the form ofvoltages. In various embodiments, signals 1007 and 1009 may originatefrom a storage node or a signal that is controlled. Through variousmeans known in the art, the voltage values of signals 1007 and 1009 maybe controlled.

Using read operation methods described herein, the sum of the voltagevalues stored at each gate of the plurality of transistors 1007 and 1009may be read through RBL 1019. For example, measuring a time delay forRBL 1019 to discharge (time to discharge), incrementally stepping up thevoltage on enable line 1017, or determining a voltage level of RBL 1019at a certain predetermined time are some read operation methods inaccordance with embodiments disclosed herein. The sum of the voltagevalues stored at each of the gate terminals of the plurality oftransistors may be used to perform multiplication or addition (of thevoltage values stored at the gate terminals).

In various embodiments, a signal received at a respective gate terminalof a transistor of the plurality of transistors (e.g., transistors 1013or 1015), may be set to be at least greater than a threshold voltage ofthat transistor. Accordingly, during a read operation, values from allthe transistors in the plurality of transistors may be read out, as allthe transistors will be turned “on” at some point during the readoperation. In other cases, the signal received at a respective gateterminal of a transistor may be below the threshold voltage.

Continuing the discussion of FIG. 10, block diagram 1003 demonstrates aportion of circuitry such as memory, where the circuitry comprises aplurality of transistors arranged in rows and columns. Using readoperation methods described herein, a Cartesian product operation may beperformed using the rows and columns in a memory.

In diagram 1003, a plurality of transistors 1021, 1023, and 1025 areconnected in series. An enable line 1027 is coupled to the gate terminalof transistor 1021. Additionally, a column word line (CWL) 1035 iscoupled to the gate terminal of transistor 1023. Transistor 1023 may becoupled to other transistors in parallel, referred to as a column. CWL1035 may be configured such that a particular column (e.g., comprisingtransistor 1023 and other transistors connected in parallel to eachother and transistor 1023) may be read. Accordingly, a row and a columnmay be picked to perform a Cartesian product operation.

Using read operation methods described herein, a sum of voltage valuesmay be read, where each voltage value is present at respective gateterminals of a row of transistors connected in series. Additionally, asum of voltage values may be read, where each voltage value is presentat respective gate terminals of a column of transistors connected inparallel. The voltage values may represent numerical values, or thevoltage values may represent logarithmic values.

In general, logarithms, including natural logarithms, map multiplicationinto addition. The logarithm function is a group isomorphism frompositive real numbers under multiplication to the group of real numbersunder addition, represented as a function. That is:log(a)+log(b)=log(ab)  (4B)Thus in the case where voltage values represent logarithmic values, asummation of these logarithmic values may be indirectly mapped to aproduct of the numerical values. That is, once the voltage valuesrepresenting logarithmic values are summed, either using time delaymethod for RBL to reach a predetermined value or voltage value of RBL atpredetermined time, the product of the numerical value can be inferredinstead of logical value. Accordingly, extra circuits needed for anantilogarithmic step may be bypassed. Since, for a given set of nnumerical values, there are a finite number of unique sums resultingfrom an addition operation or unique product resulting from amultiplication operation.

The sums output from block diagram 1003 may be subsequently summed up bya circuit such as block diagram 1001, where each sum read out of blockdiagram 1003 is sent as a voltage signal (e.g., signals 1007 and 1009)to a respective gate terminal of transistors connected in series.Accordingly, using read techniques described herein and as described indiagram 1001, a final sum may be determined. This use of diagram 1003 inconjunction with diagram 1001 may enable capability for performingmatrix calculations, linear algebra operations, etc.

In various embodiments, diagrams 1001 and 1003 may be used for signalmixing purposes. For example, diagrams 1001 and 1003 may be used foradditive mixing purposes. Signal mixing may be used for variouscommunication purposes. Additionally, block diagram 1003 may be used todetect a difference in phase of two signals.

Turning now to FIG. 11, an embodiment comprising NOR type non-volatileflash memory is shown in block diagram 1101. In block diagram 1101, asingle flash memory cell is shown comprising floating gate 1111, a gateterminal connected to line 1117, and a source or drain terminalconnected to BL 1113.

Using the read operation concepts described herein, a single readoperation may determine the value of the voltage programmed into thefloating gate 1111. In one example captured in graph 1103, four voltagevalues “V₀”, “V₁”, “V₂”, and “V₃”, may be stored in flash memory cell(block diagram 1101). Voltage values “V₀”, “V₁”, “V₂”, and “V₃” maycorrespond to different logical values represented in binary format ingraph 1103.

To determine which voltage value is stored in the flash memory cell, asingle “V_(read)” voltage value may be set to a value between voltagevalue “V₂” and voltage value “V₃”. Using concepts described previously,a delay time for BL 1113 to discharge may be used, or a measurement ofthe voltage value of BL 1113 at a predetermined time may be used todetermine which voltage value of the four is stored in the flash memorycell.

Distinguished from Flash Memory Read Operation in the Prior Art

This method varies from read operations of flash memory in the priorart, in several different ways. For read operations conducted in theprior art, three different “V_(read)” levels may be implemented to readthe voltage value stored in the flash memory cell. Additionally, for aread operation at a particular “V_(read)” level, the data collectedcorresponds to whether BL 1113 has discharged.

The embodiments described herein do not simply look for whether BL 1113has discharged over the course of three separate read attempts usingthree particular “V_(read)” values. Instead, a single “V_(read)” valuecan be used to determine the value stored in the flash memory cell.Additionally, delay times for the bit line to discharge may be assessedinstead of simply assessing whether the bit line has discharged. Inanother embodiment, the voltage value of the bit line is assessedinstead of simply assessing whether the bit line has discharged.

Further, embodiments discussed herein may read an effective value andnot an individual value as would be the case for flash memory in theprior art. Additionally, embodiments discussed herein do not performsequential reads by applying a sequence of voltages on a word line as isthe case for flash memory in prior art. Instead, in embodimentsdiscussed herein, one voltage value is applied to the word line to readthe V_(data) stored in the memory cell.

Returning to the discussion of FIG. 11, graph 1105 demonstrates possiblevoltage levels of BL 1113 using a delay time to discharge technique aspreviously described. Recall, depending on the voltage stored infloating gate 1111, BL 1113 will discharge at different rates.Accordingly, the time delay for BL 1113 to discharge may be correspondedto one of the possible stored logical values.

In the example captured in graph 1105, a strobing clock may determinehow long it takes for a bit line to reach a specified voltage level sucha V_(ref) by determining the time period taken to reach V_(ref). DelaysD₀, D₁, and D₂ may correspond to respective voltage levels “V₀”, “V₁”,and “V₂”. If a comparator detects BL 1113 has reached V_(ref) withintime delay “D₁”, surrounding circuitry may determine that a “V₁” voltagevalue is stored in the flash memory cell. If BL 1113 fails to dischargewithin one of the predetermined time delays, a conclusion may be drawnthat a voltage value “V₀” is stored in the flash memory cell.

Graph 1107 demonstrates possible measurements taken using a measuredvoltage value of BL 1113 during a predetermined time window. As the rateof discharge will vary based on the voltage value stored in floatinggate 1111, the voltage level of BL 1113 will be different at a giventime. In the example captured in graph 1107, the voltage level of BL1113 is measured at time t_(x).

Turning now to FIG. 12, methods of reading a block of flash memory cellsare described using read operations described herein. In circuit diagram1201, a plurality of flash memory cells 1219, 1217, 1215, 1213, and 1211are connected in series, to create a block of flash memory cells 1237.The block 1237 may comprise an “N” word line, where N represents thenumber of flash memories in block 1237. One end of block 1237 isconnected in series to a transistor 1219, while the other end of block1237 is connected in series to a transistor 1211.

Further, the gate terminal of transistor 1219 is connected to bit lineselect BLS line 1223, while the gate terminal of transistor 1211 isconnected to source line select SLS line 1225. A source or drainterminal of transistor 1219 is connected to a bit line (BL) 1221,whereas a remaining source or drain terminal (terminal not connected toBL 1221) is connected to block 1237. A source or drain terminal oftransistor 1211 is connected to a source line SL line 1227, whereas aremaining source or drain terminal (terminal not connected to SL 1227)is connected to block 1237.

In a scenario where data in a single flash memory cell is read, theplurality of flash memory cells except the memory cell being read iskept in a V_(pass) state. A flash memory cell put in a V_(pass) statehas a gate voltage amount set to “V_(pass)”, which ensures the flashmemory cell remains on. Thus, where the plurality of transistors totals“N”, “N−1” number of flash memory cells are kept in a V_(pass) state, sothat the value of interest in the memory cell being read may be steppedthrough the plurality of flash memory cells in block 1237. Logical datathat may be stored as V_(data) is shown in graph 1203.

Using read operation techniques described herein, based on a detectedrate of discharge or time to discharge of bit line (BL) 1221 the sum ofgate voltages stored in block 1237 may be determined. In one embodiment,all the flash memory cells may be put into a “V_(pass)” state. Usingread operation techniques described herein, a total sum of theresistance of block 1237 may be determined.

In one example the read current(I) for block 1237 may be defined as:I=V _(BL)/(n*R _(ON))  (5)where V_(BL) is the voltage of the bit line, n represents a number oftransistors in series whose gate terminal voltage is at V_(pass), andR_(ON) represents the resistance of the flash memory cell whenconducting current. For the flash memory cells in block 1237 operatingin the ohmic region (i.e., the linear region, where(V_(GS)−V_(TH))>V_(DS)), the drain current I_(DS) may be defined as:I _(DS) =K[(V _(GS) −V _(TH))*V _(DS)(V _(DS) ²/2)]  (6)where K represents a mobility factor, V_(GS) represents the voltagebetween the gate and source terminals, V_(TH) represents a thresholdvoltage amount that turns the flash memory cell “on”, and V_(DS)represents the voltage between drain and source terminals. In someembodiments, when V_(DS) is small, I_(DS) may be defined as:I _(DS) =K[(V _(GS) −V _(TH))*V _(DS)]  (7)The resistance (R_(ON)) of the flash memory cells may be defined as:R _(ON) =V _(DS) /I _(DS)=1/[K*(V _(GS) −V _(TH))]  (8)

Two read operation techniques and example bit line voltage levels areshown in graphs 1205 and 1207. In graph 1205, a delay time for BL 1221to discharge technique is captured, wherein a span of time taken for BL1221 is measured as a delay time and based on the measured delay time,the voltage values stored in the flash memory cells in block 1237 may bedetermined. In graph 1207, a rate of discharge of BL 1221 may bemeasured, where a voltage value is measured of BL 1221 at apredetermined time t_(x).

Turning now to FIG. 13, another read operation technique for a 1T DRAMcell is discussed. In block diagram 1302, previously described 1T DRAMdiagram 201 is reproduced. Recall, BL 215 is connected to a source ordrain terminal of transistor 209. Further BL 215 may be connected to avariable capacitor 1313 (to compensate for process variations of thememory cell capacitance and the nominal bit line capacitance). BL 215may be set at a “high voltage” where a capacitance of variable capacitor1313 may be varied. At time t₀, word line (WL) 213 may be turned on.

Based on the value of V_(data) 1345, charge sharing will occur over BL215. Depending on the value at which the charge sharing settles, adetermination may be made of the voltage value of V_(data) 1345. Thatis, BL 215 may discharge to a certain voltage level and settle at thevoltage level after a span of time. Based on the level at which thevoltage of BL 215 settles a determination may be made of the voltagevalue of V_(data) 1345.

Graph 1311 demonstrates the various logical values that may berepresented by respective voltage values stored as V_(data) 1345. Graph1309 demonstrates different levels at which BL 215 may settle after aspan of time due to charge sharing. Thus, subsequent to time t₀ when WL213 goes high, at a time predetermined time t₁, the voltage level of BL215 may be measured to determine the voltage value of V_(data) 1345.

Turning now to FIG. 14, a block diagram of a circuit with the capabilityof comparing different V_(data) voltage values is shown. Block diagram1401 depicts two blocks 1490 and 1492, respectively, of transistorsconnected in a 2T DRAM configuration. In block 1490, a gate terminal oftransistor 1441 is connected to a write word line (WWL₁) 1417 while asource terminal of transistor 1441 is connected to write bit line (WBL)1407. As mentioned previously, the source and drain of transistorsdiscussed herein are interchangeable. Thus, a source terminal may be adrain terminal in some embodiments, and vice versa.

The drain terminal of transistor 1441 is connected to a gate terminal oftransistor 1443, where a source terminal of transistor 1443 is connectedto a data word line (DWL₁) 1415. A drain terminal of transistor 1443 isconnected to a source terminal of transistor 1433, and a source terminalof transistor 1433 is connected to a read bit line (RBL) 1409. A firstdata, Vdata₁, may be stored in the 2T DRAM cell (block 1490).

The source terminal of transistor 1433 is also connected to a sourceterminal of transistor 1423, where transistor 1423 comprises one of twotransistors in the 2T DRAM cell denoted by block 1492. The drainterminal of transistor 1423 is connected to a DWL₀ line and a gateterminal of transistor 1423 is connected to a drain terminal oftransistor 1421. The source terminal of transistor 1421 is connected towrite bit line (WBL) 1407. A gate terminal of transistor 1421 isconnected to write word line 0 (WWL₀) 1411. A second data, Vdata₀, maybe stored in the 2T DRAM cell (block 1492).

To compare which data is greater between the two blocks 1490 and 1492,initially RBL 1409 may be charged to a “high” value such as VDD. DWL₀may be at a voltage level around zero and DWL₁ may be at a voltage levelaround “high”. Depending on values of Vdata₁ and Vdata₀, RBL 1409 maydischarge differently.

Block diagram 1451 is similar to block diagram 1401, however, therespective blocks comprising 2T DRAM cells, blocks 1496 and 1498, areconnected to separate write bit lines (WBL₁ and WBL₀). Whereas in blockdiagram 1451, the two blocks 1490 and 1492 share a single write bit line1407.

Turning now to FIG. 15, an example of circuitry that may be used tocorrelate a measured delay time to a stored voltage value is discussed.One of the read operations previously discussed includes a time todischarge method that correlates a measured delay time to a voltagevalue. Graph 905 is reproduced from FIG. 9, which captures voltagevalues of a read world line (RWL), read bit line (RBL), and delay timesmeasured at predetermined times. Additionally, a strobe clock 1510 isshown superimposed on graph 905.

Block diagram 1501, illustrates in block diagram form some circuitrythat may correlate a delay time to a voltage value. In block diagram1501, a delay line 1505 is connected to RBL 1503. The delay line 1505 inturn is connected to a capture flip flop 1507. A strobe clock signal1510 is input to the capture flip flop 1507. The output capture flipflop 1507 may have several bits (e.g., S₀, S₁, S₂, . . . , S_(k-1),S_(k)). In some embodiments, the delay line 1505 may include a serialchain of non-inverting buffers, each having a respective output that iscoupled to an input of an individual flip flop within the output captureflip flop 1507.

The various delay times D₀, D₁, D₂, . . . , D₆ propagate through delayline 1505. The smallest delay D₀ propagates for the most amount of timethrough delay line 1505. The largest delay D₆ propagates for the leastamount of time through the delay line. And for the condition where RBL1503 does not switch, there is no change in value in delay line 1505.The propagation length of the delay time through delay line 1505 may becorrelated to the logical value stored in a 3T DRAM cell.

For example, D₀ may be set to determine if a bit line falls below athreshold voltage value 931 within a first predetermined time window. Inthe event that the bit line falls below the threshold voltage valuewithin the first predetermined time window, D₀ begins propagating a “1”through delay line 1505.

In the event that the bit line does not fall within the thresholdvoltage value within the first predetermined time window, D₀ will notpropagate a “1”. Taking this scenario further, D_(i) may be set todetermine if a bit line falls below a threshold voltage value within asecond predetermined time window, where the second predetermined timewindow occurs later in time than the first predetermined time window. Inthe event that the bit line falls below the threshold voltage valuewithin the second predetermined time window, D₁ begins propagating a “1”through delay line 1505. Thus, D₁, will have propagated a “1” for lesstime than the case where D₀ begins propagating. That is, the delay line1505 may reflect the below values for respective delay times:

$\begin{matrix}{D_{0}\text{:}\mspace{14mu} 1111111111111111000} & (9) \\{{D_{1}\text{:}\mspace{14mu} 1111111111111100000}\ldots} & (10) \\{D_{6}\text{:}\mspace{14mu} 1100000000000000000} & (11)\end{matrix}$

A strobe clock 1510 may be set to fire at a time t₈, after all delaytimes have passed. The strobe clock may capture data reflecting how longa “1” has propagated through the delay line and this may be correlatedto voltage value of V_(data) and in turn a logical value.

Turning now to FIG. 16, an example method in accordance with at leastsome embodiments for performing read operations is discussed. The methodmeasures a time to discharge of a bit line. In various embodiments, someof the blocks shown in FIG. 16 may be performed concurrently, in adifferent order than shown, or omitted. Additional method elements maybe performed as desired.

Initially, one or more clocks may be set to strobe an output of a 3TDRAM cell at one or more predetermined time windows (block 1601). Next,a voltage level at the output of the 3T DRAM cell may be obtained duringone of the one or more predetermined time windows (block 1603). Anassessment may be made as to whether the obtained voltage level is belowa predetermined threshold (decision block 1605).

If the obtained voltage level is below the predetermined threshold, thena logical value may be determined based on the predetermined time windowduring which the voltage level fell below the predetermined threshold(block 1609). If the obtained voltage level is not below thepredetermined threshold, a second assessment is made on whether athreshold amount of time has passed since the beginning of the readoperation (decision block 1607).

If a determination is made that the threshold amount of time has passed,then a conclusion is drawn that the voltage value stored in the 3T DRAMcell is zero (block 1611). Recall, when a lower voltage value is storedin the 3T DRAM cell, the bit line of the cell may be slower to dischargethan if a higher voltage value was stored. If a determination is madethat the threshold amount of time has not passed, then the method flowsto block 1603 where a voltage level is measured at one of the one ormore predetermined time windows.

Turning now to FIG. 17, an example method in accordance with at leastsome embodiments for performing read operations is discussed. The methodmay track the number of times a voltage level of a word line has changedbefore a bit line begins discharging. In various embodiments, some ofthe blocks shown in FIG. 17 may be performed concurrently, in adifferent order than shown, or omitted. Additional method elements maybe performed as desired.

Initially, a voltage level of a word line of a 2T or a 1T DRAM cell maybe changed by a predetermined amount (block 1701). Next, a counter orsome other mechanism may be used to track the number of times thevoltage level of the word line has changed (block 1703).

An assessment is made whether the number of times the voltage level haschanged is greater than a preset number (decision block 1705). If thenumber of times the voltage level has changed is greater than a presetnumber, then a conclusion is drawn that the voltage value stored in thecell is zero (block 1713).

If the number of times the voltage level has changed is less than apreset number, then a voltage level of the bit line of the 2T or 3T DRAMcell is obtained (block 1707). Next a determination is made as towhether the obtained voltage level is below a predetermined threshold(decision block 1709).

If the obtained voltage level is not below the predetermined thresholdthen the method flows to block 1701 where a voltage level of the wordline is changed by a predetermined amount. If the obtained voltage levelis below the predetermined threshold then a determination of the logicalvalue stored in the 2T or 1T DRAM cell is made (block 1711). Asdiscussed previously, the number of times the voltage level has beenchanged is correlated to a voltage value stored as V_(data) and in turnV_(data) is correlated to a logical value.

Turning now to FIG. 18, an example method in accordance with at leastsome embodiments for performing a read operation of a row of memorycells is discussed. The method stops the read operation once adetermination is made that all values in the row of memory cells havebeen determined. In various embodiments, some of the blocks shown inFIG. 16 may be performed concurrently, in a different order than shown,or omitted. Additional method elements may be performed as desired.

Initially, a voltage level is changed, of a word line connected to aplurality of DRAM cells comprising a row (block 1801). Next the numberof DRAM cells in the row where the stored logical value has beendetermined is tracked (block 1803). Next an assessment is made as towhether the logical value stored in a DRAM cell has been determined forall the DRAM cells in the row (decision block 1805).

If some logical values have yet to be determined in the row of DRAMcells, the method flows to block 1801, where a voltage level of the wordline is changed by a predetermined amount. If all logical values havebeen determined in the row of DRAM cells, the method stops (block 1807).

The method described in FIG. 18 implements a power saving method forreading a row of memory cells in accordance with read operation methodsdescribed herein. For example, eight memory cells may be connected to asingle word line. The memory cells may be programmed to store one ofeight logical values.

To determine the logical values stored in each of the memory cells, theread word line voltage may be stepped down in increments, in accordancewith a read operation described in FIG. 5. The read operation may readthe eight memory cells simultaneously. In this example, logical valuesare assigned to voltage values “V₁”-“V₇” similar to the examplediscussed in FIG. 5.

In cases where the voltage values stored in respective memory cells isgreater than “V₁”, the power savings method may save power. For example,if none of the voltage values stored in the row of memory cells wasbelow “V₄”, the read operation would initially step down the voltagevalue of the word line by one increment. If any memory cells in the rowcontain a voltage value of “V₇”, these values would be detected at therespective output bit line. Next, the voltage level of the word linewould be stepped down by another increment. If any memory cells in therow contain a voltage value of “V₆”, these values would be detected atthe respective output bit line. The stepping down of the word linevoltage continues until voltage values of all eight memory cells isdetermined.

A counter may track the number of cells of the eight memory cells wherea determination has been made of the stored voltage value. In thisexample, where the lowest voltage value stored in the row is “V₄”, themethod of stepping down the voltage value of the word line may end oncethe “V₄” value is read out. The counter tracking the number of memorycells where the stored value has been determined would reflect that alleight values have been determined. Accordingly, the method would nothave to continue stepping down the voltage level of the word line beyondthe level for reading “V₄”. Thus, instead of conducting a voltage changeof the word line seven times, in this example, the entire row may beread after changing the voltage level of the word line four times. Thisexample illustrates that power may be saved during a read operation.

Turning now to FIG. 19, an example method in accordance with at leastsome embodiments for performing a read operation of a row of memorycells is discussed. The method stops the read operation once adetermination is made that all values in the row of memory cells hasbeen determined. In various embodiments, some of the blocks shown inFIG. 19 may be performed concurrently, in a different order than shown,or omitted. Additional method elements may be performed as desired.

Initially a voltage level is measured at respective outputs of aplurality of DRAM cells comprising a row (block 1901). Next, the numberof DRAM cells in the row where the stored logical value has beendetermined is tracked (block 1903). Next an assessment is made as towhether the logical value stored in a DRAM cell has been determined forall the DRAM cells in the row (decision block 1905).

If some logical values have yet to be determined in the row of DRAMcells, the method flows to block 1901, where a voltage level atrespective bit lines of the row of DRAM cells is measured. In variousembodiments, the read operations that may be used in this method includemeasuring a delay time to discharge of a bit line. If all logical valueshave been determined in the row of DRAM cells, the method stops (block1907).

Similar to the method described in FIG. 18, the method described in FIG.19 implements a power saving method for reading a row of memory cells inaccordance with read operation methods described herein.

Turning now to FIG. 20, block diagrams 2001 and 2003 illustrateconfigurations that allow for row-column operation of bit cells such asbit cell 2007, arranged in one or more arrays 2005. Block diagram 2003may implement an orthogonal read write operation. Block diagram 2003 maycomprise a two dimensional array where one or more rows are shown aswrite word lines WWL₀, WWL₁, . . . , and WWL_(m) and one or more columnsare shown as read word lines RWL₀, RWL₁, . . . , and RWL_(m). The rowand column designations are interchangeable between the write word linesand read word lines. The read and write word lines are orthogonal withrespect to each other and similarly corresponding read and write bitlines are also orthogonal with respect to each other.

An orthogonal read write operation using array 2003 is enabled by thebit cell 2007, which may comprise a 3T DRAM memory cell. As shown inblock diagram 2001, a 3T DRAM memory cell comprises three transistors2037, 2039, and 2041. Two transistors 2039 and 2041 are connected inseries while a drain terminal of transistor 2037 is connected to a gateterminal of transistor 2039. V_(data) 2035 is stored at the node wherethe drain terminal of transistor 2037 is connected to the gate terminalof transistor 2039. A source terminal of transistor 2037 is connected toa write bit line 2043, while a write word line 2045 is connected to agate terminal of transistor 2037. A read word line 2047 is connected toa gate terminal of transistor 2041, while a drain terminal of transistor2041 is connected to a read bit line 2049. Block diagram 2001 is similarto bit cell 205 (FIG. 2) except that the read and write word lines aremutually orthogonal to each other.

Block diagram 2003 may store a matrix of dimension (m, n) where m and nmay be equal or different. Further the write and read operationperformed by block diagram 2003 may perform a matrix transposeoperation. For example, write word lines are corresponding to roworientation of a matrix, then during the write operation the data iswritten into the matrix in row orientation. And during the readoperation the data from the matrix is read in the column orientationwhich is the transpose operation of the matrix.

Turning now to FIG. 21, block diagrams 2101 and 2103 illustrateconfigurations that may be used with 4T DRAM with orthogonal read. Blockdiagram 2101 comprises a 4T DRAM and has an additional transistor 2117which enables read operation in the same orientation of write operation.Block diagram 2103 comprises a 4T DRAM and has an additional transistor2137 when compared to the 3T DRAM (FIG. 20). Compared to the array ofbit cells discussed in block diagram 2003, the array of bit cells of2101 has an additional set of read word lines and corresponding read bitlines. Similarly, the array of bit cells 2103, compared to the array ofbit cells discussed in block diagram 2003, has additional sets of readword lines sharing a common bit line with the corresponding write wordlines. The arrays of bit cells in block diagrams 2101 and 2103 duringwrite and read operations perform a matrix transpose operation similarto the array of bit cells in block diagram 2003, in addition to a normalmatrix read operation.

Turning now to FIG. 22, block diagrams 2201 and 2203 illustrateconfigurations that may be used with 5T DRAM with orthogonal read andwrite. Compared to the 4T DRAM illustrated in 2101 and 2103, the 5T DRAMillustrated in 2201 and 2203 have a pair of additional transistors 2211,2215 and 2261, 2265 respectively. This additional pair of transistorswith the corresponding read and write word line enables read and writeoperation in both row and column orientation in an array of bit cells.Compared to the array of bit cells discussed in block diagram 2003, thearray of bit cells in block diagram 2201 has additional sets of read andwrite word lines with the corresponding read and write bit lines.Similarly, the array of bit cells in block diagram 2203, compared to thearray of bit cells discussed in block diagram 2003, has an additionalset of read and write word lines. Both sets of mutually orthogonal readand write word lines share a corresponding set of common bit lines.Also, the sets of common bit lines are mutually orthogonal to eachother. The arrays of bit cells in block diagrams 2201 and 2203 duringwrite and read operations perform a matrix operation like arrays of bitcells in block diagram 2003 and, additionally, perform a columnorientation read and write operations to read and write data to a columnof a matrix. The 5T DRAM compared to 4T DRAM illustrated in FIG. 21 hasan additional write port to perform write operations in both row andcolumn orientation.

The 3T DRAM described in FIG. 4 along with several embodiments describedherein, such as embodiments in FIGS. 9, 10, 12, etc. are applicable toDRAMs illustrated in FIGS. 20, 21 and 22.

Turning now to FIG. 23, block diagram 2301 illustrates configurationsthat may be used with 2T DRAM with orthogonal read and write similar toa 5T DRAM. Block diagram 2303 illustrates configurations that allow forrow-column operation of bit cells such as bit cell 2307, arranged in oneor more arrays 2305. Block diagram 2303 may comprise a two dimensionalarray where one or more rows are shown as word lines WL₀, WL₁, . . . ,and WL_(m) and one or more columns are shown as orthogonal word linesOWL₀, OWL₁, . . . , and OWL_(m). The row and column designations areinterchangeable between the word lines and orthogonal word lines. Theword lines and orthogonal word lines are orthogonal with respect to eachother and similarly, the corresponding bit lines and orthogonal bitlines are also orthogonal with respect to each other.

The array of bit cells in block diagram 2303 during write and readoperation performs a matrix operation similar to arrays of bit cells inblock diagrams 2201 and 2203. The 1T DRAM described in FIG. 7 and FIG.13, along with several embodiments described herein, are applicable tothe 2T DRAM illustrated in FIG. 23

Turning now to FIG. 24, block diagram 2401 of a circuit that may be usedto compare two signals is shown. Block diagram 2401 comprises threetransistors 2405, 2407, and 2409, connected in series. A gate terminalof transistor 2405 is connected to an enable line (EN) 2421, a gateterminal of transistor 2407 is connected to an input line (IN) 2415, anda gate terminal of transistor 2409 is connected to a reference line(REF) 2413. A conduction electrode (e.g., source or drain) of transistor2405 is connected to a read bit line (RBL) 2411.

The time to discharge method described in FIG. 9 may be applied tomeasure the phase overlap of two signals 2417 and 2419. The two signals2417 and 2419 may be aligned to turn on transistors 2407 and 2409.Furthermore, a signal on enable line 2421 may also turn on transistor2405 contemporaneous to when signals 2417 and 2419 are applied totransistors 2407 and 2409. Signals 2415 and 2413 may be applied totransistors 2407 and 2409 for a duration of time sufficient to dischargeRBL 2411. Whether or not signals 2417 and 2419 are aligned in phase maybe determined based on the time to discharge of RBL 2411. For example,if signals 2417 and 2419 are aligned in phase, the time to discharge ofRBL 2411 will be lesser than when signals 2417 and 2419 are out ofphase. Accordingly, the time to discharge method may be used to assessthe phase alignment of at least two signals.

In another example, a plurality of block diagrams such as block diagram2401 may be connected in parallel or in series. Using the plurality ofblock diagrams 2401, a plurality of reference signals (i.e., 2417) maybe used to assess a phase of an input signal. The plurality of referencesignals may differ in both phase and/or frequency. The block diagram2451 is an illustrative example comprising a plurality of block diagrams2401 having a common enable signal EN (2461) and input signal IN (2459)with plurality of reference signals REF₁, REF₂, REF₃, . . . REF_(m) usedto assess the phase of the input signal IN. By applying a time todischarge method as discussed herein, the phase of the input signal maybe determined and this is performed in block 2455.

Turning now to FIG. 25, a block diagram illustrates another example of acircuit configuration that may utilize the embodiments discussed herein.Diagram 2501 comprises two transistors 2509 and 2507 connected inparallel, with respective voltages V_(gs1) and V_(gs0) coupled to theirrespective gates. Additionally, a conduction electrode (e.g., source ordrain) of transistor 2505 is connected to respective conductionelectrodes of transistors 2509 and 2507. A gate terminal of transistor2505 is connected to read word line (RWL) 2513, while a conductionelectrode (e.g., source or drain not connected to the transistors inparallel), is connected to read bit line (RBL) 2511.

Diagram 2503 is a circuit diagram equivalent to diagram 2501. However,the transistors 2509 and 2507 are represented as variable resistors 2539and 2537 connected in parallel. Where the total time to discharge of RBL2531 is equivalent to the product of the circuit resistance and thecircuit capacitance.

$\begin{matrix}{\left. {{{RC}\mspace{14mu}{time}\mspace{14mu}{constant}} = {\left( R_{0} \right.R_{1}}} \right) \times C_{BL}} & (12) \\{{\text{=>}\mspace{14mu}{RC}\mspace{14mu}{time}\mspace{14mu}{constant}} = {\left( \frac{R_{0}R_{1}}{R_{0} + R_{1}} \right) \times C_{BL}}} & (13)\end{matrix}$where R₀ and R₁ represent a variable resistance and C_(BL) represents acapacitance of RBL 2531. For different values of R₀ and R₁, the RC timeconstant value varies which changes the time delay for discharging. Inequation 12, above, the resistance value of transistor 2535 isconsidered to be so much smaller than resistances R0 and R1 that theresistance of transistor 2535 is negligible. Thus, the resistance valueof transistor 2535 is not included in the RC time constant calculation.In embodiments where the resistance value of transistor 2535 is largerso as not to be negligible, the resistance value may also be included asan offset in the RC time constant calculation.

Turning now to FIG. 26, block diagram 2601 illustrates configurationsthat may be used with a memory array of cells that include a photodiodesensor. Each memory cell 2602 includes a photodiode sensor 2604 coupledbetween internal V_(photo) node 2606 and ground. When a reset signal RSTis active, this V_(photo) node 2606 is driven by transistor 2608 to areset voltage VRST that is coupled to the drain terminal of transistor2608. When the reset signal RST is inactive, the current generatedthrough the photodiode sensor 2604, in response to incident light,results in a decreasing voltage on V_(photo) node 2606 that is afunction of the magnitude of incident light times the accumulation time.To interrogate the memory cell 2602, a row select signal ROWSEL isactivated to couple the memory cell 2602 to a column line 2614, alsolabeled COL, which is loaded by a bias current (I_(bias)) 2616 toground. Since the drain terminal of transistor 2610 is coupled to VDD,and since the gate terminal of transistor 2610 (i.e., the V_(photo) node2606) is typically lower in voltage than its drain terminal, transistor2610 functions as a source-follower. The select transistor 2612 may beviewed as a switch, and thus the resulting voltage on the column line2614 is driven to a value that is approximately a threshold voltagebelow the V_(photo) node 2606 voltage. In other words, the circuitcomprising transistors 2610, 2612 and current source 2616 functions as avoltage translation or level-shifting circuit to impart on the column2614 a voltage that offset from (i.e., corresponds to) the voltage ofthe V_(photo) node 2606 in the selected memory cell 2602.

The voltage of the column line 2614 may be determined by using a time todischarge technique as described earlier herein. In this embodiment, asensing block (i.e., discharge circuit) 2620 comprises two N-channeltransistors 2626 and 2624 connected in series between a discharge node2630 and ground. The gate terminal of transistor 2626 is coupled to thecolumn line 2614, and the gate terminal of transistor 2624 is coupled toan enable signal EN conveyed on node 2618. A third P-Channel transistor2622 couples the discharge node 2630 to VDD when the enable signal ENcoupled to its gate terminal is inactive (e.g., low). Similar to thedescription in regards to FIG. 8, when the enable signal EN is active(e.g., high), the discharge node 2630 will discharge a rate based on thevoltage of the column line 2614, which voltage, as mentioned above,likewise depends on the voltage of the V_(photo) node 2606.

A time to discharge circuit 2632, such as described herein in regards toFIG. 15 or FIG. 34, may be coupled to the discharge node 2630 and drivenby a strobe clock signal STROBE CLK conveyed on node 2634, to generate adigital output reflective of the incident light falling upon the memorycell 2602. In some embodiments, the accumulation time for a given cell,such as cell 2602, may be determined by the length of time necessary tointerrogate all of the other cells coupled to the same column line 2614(which other cells are not shown in FIG. 26).

Other embodiments are contemplated for memory cells incorporatingphotodiode sensors. For example, a configuration as shown in FIG. 4 maybe used, in which the V_(photo) node is coupled to the gate oftransistor 239 (i.e., the V_(data) node 401).

Turning now to FIG. 27, block diagram 2701 illustrates a configurationthat may be used with an array of 1T DRAM memory cells such as memorycell 201 shown in FIG. 2. Four such memory cells 201 are shown, eachcoupled to a respective one of word lines 2702, 2704 and a respectiveone of bit lines 2706, 2708, although in anticipated embodimentsadditional such word lines (not shown) would be present, each coupled toa respective pair of additional memory cells 201 (not shown). Betweenactive cycles, a complementary pair of precharge signals PCH, PCHB areasserted. During such time, a first precharge transistor 2768 couplesthe bit line 2706 to GND since the precharge signal PCH conveyed on node2716 is high, and a second precharge transistor 2766 couples the bitline 2708 to VDD since the complementary precharge signal PCHB conveyedon node 2714 is low. The complementary precharge signals PCH, PCHB arethen de-asserted, and a complementary pair of equilibration signals EQ,EQB conveyed on respective nodes 2712, 2710 are then asserted to coupletogether the pair of bit lines 2706, 2708 by way of P-channelequilibration transistor 2762 and N-channel equilibration transistor2764, and thus establish an equilibration voltage (i.e., a referencecondition) on both bit lines 2706, 2708 that is an intermediate voltagebetween VDD and ground. In this example, the equilibration voltage isapproximately VDD/2 on both bit lines 2706, 2708.

The voltage of the bit lines 2706, 2708 may be determined by using atime to discharge technique as described herein. In this embodiment, asensing or discharge circuit 2720 comprises two N-channel transistors2726 and 2724 connected in series between a read bit line (RBL₀) node2730 and ground. The gate terminal of transistor 2726 is coupled to thebit line 2706, and the gate terminal of transistor 2724 is coupled to anenable signal EN conveyed on node 2718. A P-Channel transistor 2722couples the read bit line node 2730 to VDD when the enable signal ENcoupled to its gate terminal is inactive (e.g., low). Similar to thedescription in regards to FIG. 8, when the enable signal EN is active(e.g., high), the read bit line node 2730 will discharge at differentrates based on the voltage of the bit line 2706. A time to dischargecircuit 2732, such as described above in regards to FIG. 15 or FIG. 34,is coupled to the read bit line node 2730 and driven by a strobe clocksignal STROBE CLK conveyed on node 2734, to generate a digital outputOUT₀ (conveyed on node(s) 2736) reflective of the discharge rate of theread bit line 2730, which in turn is reflective of the voltage on BL₀(i.e., bit line 2706).

A second sensing or discharge circuit 2740 comprises two N-channeltransistors 2746 and 2744 connected in series between a read bit line(RBL₁) node 2750 and ground. The gate terminal of transistor 2746 iscoupled to the bit line 2708, and the gate terminal of transistor 2744is coupled to the enable signal EN conveyed on node 2718. A P-Channeltransistor 2742 couples the read bit line node 2750 to VDD when theenable signal EN coupled to its gate terminal is inactive (e.g., low).When the enable signal EN is active (e.g., high), the read bit line node2750 will discharge at different rates based on the voltage of the bitline 2708. A second time-to-discharge circuit 2752 is coupled to theread bit line node 2750 and driven by the strobe clock signal STROBE CLKconveyed on node 2734, to generate a digital output signal OUT₁(conveyed on node(s) 2756) reflective of the discharge rate of the readbit line 2750, which in turn is reflective of the voltage on BL₁ (i.e.,bit line 2708).

Turning now to FIG. 28, block diagram 2801 illustrates example waveformscorresponding to the configuration shown in FIG. 27, and whichillustrates self-referencing operation in which a calibration is firstperformed before a read operation to determine a respective referencedelay for each respective column, and then a respective memory cell foreach respective column is accessed and compared to the respectivereference delay to determine whether the respective cell being read is a“0” or a “1.”

In the block diagram 2801, the waveform 2810 represents a clock signalCLK that may correspond to an external or internal timing signalinitiating a memory read cycle. The WL waveform 2812 corresponds to aselected word line, such as word line WL₀ (node 2702) or word lineWL_(n) (node 2704). The EN waveform 2814 corresponds to the enablesignal EN conveyed on node 2718. The BL waveform 2816 corresponds to oneof the bit lines, such as bit line BL₀ (node 2706) or bit line BL₁ (node2708). The RBL waveform 2818 corresponds to one of the read bit lines,such as read bit line RBL₀ (node 2730) or read bit line RBL₁ (node2750). Lastly, the STROBE CLK waveform 2820 corresponds to the strobeclock signal conveyed on node 2734.

The waveforms shown in block diagram 2801 assume the bit lines (e.g.,BL₀, BL₁) have already been equilibrated at VDD/2, and the read bitlines (e.g., RBL₀, RBL₁) have already been precharged to VDD, both asdescribed above. The waveforms begin at time t₀ with the assertion ofthe clock signal CLK to initiate a memory read cycle. At time t₁ theenable signal EN (waveform 2814) is asserted to enable the respectivedischarge circuits 2720, 2740 to begin discharging the respective readbit lines RBL₀, RBL₁ coupled to each respective output node 2730, 2750.For ease of discussion, a single bit line, read bit line, andcorresponding output will now be discussed, although it should beunderstood that all such nodes and associated circuits behave similarly.At time t₂ the read bit line RBL has fallen to half its initial voltage(or some other predetermined percentage of its initial voltage, asfurther described below), and at time t₃ the strobe clock signal STROBECLK conveyed on node 2734 is asserted to latch the outputs of thetime-to-discharge circuits 2732, 2752 in order to determine referencedelays D₁ and D₂ corresponding to the bit line BL being at theequilibration voltage VDD/2 without any influence of a memory cell(i.e., with the selected word line still inactive). Subsequently theenable signal EN is de-asserted to again precharge the RBL line. Theoperation thus far accomplishes a calibration operation to determine therespective pair of reference delays D₁ and D₂ for each respective bitline BL.

Then, at time t₄, the selected word line WL is asserted (e.g., drivenhigh) to couple the charge from the corresponding memory cell onto thebit line BL, which causes the voltage on the BL to either rise or fallby an amount “ΔV” corresponding largely to the charge stored in thememory cell and the capacitance of the bit line BL. At time t₅ theenable signal EN is re-asserted to discharge the read bit line RBL at arate corresponding to the voltage of the associated bit line BL. In acase where the bit line BL voltage is VDD/2+ΔV, time t₆ corresponds tothe time when the read bit line RBL has fallen to half its initialvoltage. In the case where the bit line BL voltage is VDD/2−ΔV, time t₇corresponds to the time when the read bit line RBL has fallen to halfits initial voltage. Time t₇ occurs later than time t₆ because the bitline voltage is lower, and thus the gate drive of the transistordischarging the read bit line (e.g., transistor 2726) is lower. At timet₈ the strobe clock signal STROBE CLK is asserted to latch the outputsof the time-to-discharge circuits 2732, 2752 in order to determine thetime when the associated read bit line RBL falls to half its initialvalue (i.e., to determine relative delays D₃ and D₅ in the case wherethe bit line BL voltage is VDD/2+ΔV, or to determine relative delays D₄and D₆ in the case where the bit line BL voltage is VDD/2−ΔV). Themeasured delay (i.e., D₃ or D₄) can be compared to the reference delayD₁ to determine whether the memory cell being read is a “1” or a “0”.

The above embodiment is described in the context of using atime-to-discharge circuit to determine when the voltage of a read bitline RBL falls to half its initial voltage, as a result of low swingsignaling on the bit line itself (i.e., rather than measuring the timeto discharge the bit line). These principles may be applied on a broaderscale to measure signal nodes other than a read bit line, includingperforming a calibration delay measurement followed by a read delaymeasurement, and comparing the measured read delay against the measuredcalibration delay to determine the stored data value(s).

Turning now to FIG. 34, an embodiment 3400 of a time-to-transitioncircuit is shown in block diagram form. As introduced in FIG. 15described above, such a circuit can correlate a delay time to a voltagevalue. Moreover, the embodiment 3400 can be utilized to measure acalibration delay and measure a read delay, and compare the measuredread delay against the measured calibration delay to determine thestored data, as described above. In this embodiment an input signal 3402is coupled to an input stage 3404, whose output 3406 is coupled to aninput of a delay line 3408. The delay line 3408 has a parallel outputs3410, each respectively corresponding to a respective stage of the delayline 3408. These outputs 3410 are coupled to the inputs of capturelatches 3412, which are latched by a STROBE signal 3420 to generatecorresponding latch outputs 3414. A detect, store and compare block 3416receives the latch outputs 3414 and, in response to control signals3422, generates an output 3418.

In some embodiments, the delay line 3408 may include a serial chain ofnon-inverting buffers, each having a respective output that is coupledto an input of an individual flip flop (e.g., latch, register) withinthe capture latches 3412. In some embodiments, the delay line 3408 mayinclude a serial chain of inverting buffers, with the capture latches3412 having alternating true and complementary outputs to present allsuch outputs with the same polarity.

The input stage 3404 can be configured to set the “predeterminedpercentage” described above, and also to “condition” the input signal3402 to provide a better output signal 3406 to the delay line 3408. Forexample, the input threshold of input stage 3404 can be configured to adesired value, such as the midpoint voltage between power and ground, oroffset to a value higher or lower than the midpoint, or a predeterminedpercentage of the initial voltage of an input signal (e.g., a read bitline or other signal node), as desired. This can be achieved byappropriate sizing of an input inverter, or by using a comparator withan appropriate reference voltage, or by using other techniques. Asanother example the input stage 3404 can “sharpen” a slowly-changinginput signal 3402 by generating an output signal 3406 having a sharper(i.e., more precise) timing edge, irrespective of the input thresholdvalue.

During a calibration measurement operation, the detect, store andcompare block 3416 receives the latch outputs 3414 (as latched by theSTROBE signal 3420), determines which capture latch output 3414 reflectsthe delay time of the “calibration” input signal through the delay line(i.e., determines which latch output 3414 corresponds to the change fromone data value to the other data value as the calibration input signalpropagated through the delay line 3408), then saves that determinedvalue. During a subsequent read measurement operation, the detect, storeand compare block 3416 again receives the latch outputs 3414 as latchedby the STROBE signal 3420, determines which capture latch output 3414reflects the delay time of the “read” input signal through the delayline, then compares that value against the saved value to determine thevalue of the output signal 3418.

In some embodiments, a calibration functionality is not utilized. Insuch embodiments, the detect, store and compare block 3416 can determinewhich capture latch output 3414 reflects the delay time of the “read”input signal through the delay line, then generate an output signal 3418reflective of that value.

Referring now to FIG. 35, an embodiment 3500 is depicted whichrepresents a generalized block diagram of a read circuit not unlike thatdescribed above in regards to FIG. 27. In this embodiment, a firstcircuit 3502 is coupled to a first node 3506. When enabled by the ENABLEsignal 3504, the first circuit 3502 couples a first signal onto thefirst node 3506. A read circuit 3510 includes a voltage transitioncircuit 3512 and a time-to-transition measurement circuit 3516. Thefirst node 3506 is coupled to an input 3508 of the voltage transitioncircuit 3512, which causes a voltage transition on signal node 3514 inresponse to the first signal coupled onto the first node 3506. Thetime-to-transition measurement circuit 3516 can measure the delay of thetransitioning signal on the signal node 3514, and generate an outputsignal 3520 accordingly.

In some embodiments, the voltage transition circuit 3512 can be viewedas a sensing or discharge circuit (e.g., the read discharge circuit 2720depicted in FIG. 27), and can also include, in some embodiments,initialization circuits (e.g., equilibration and precharge circuits). Insome embodiments, the time-to-transition measurement circuit 3516 can bea time-to-discharge circuit (e.g., such as that described in regards toFIG. 15 or FIG. 34) or a time-to-charge circuit. In some embodiments,the first circuit 3502 can be a memory cell, such as a 1T DRAM memorycell 201 as shown in FIG. 2.

As can be appreciated, the various circuits and techniques describedherein utilize a variable delay as an indicator of a value stored in amemory cell. Consequently, the time delay can be viewed as a statevariable that provides information about the data value stored in thememory, and the circuits described herein may be viewed as “time-basedcircuits.”

Turning now to FIG. 29, a three transistor (3T) DRAM memory cell 205 inaccordance with various embodiments is discussed. The magnitude of acurrent that discharges a read bit line may be sensed to discern thevalue stored within the memory cell 205.

In this example, eight logical values 0-7 for V_(data), represented inbinary nomenclature in graph 403, may be stored into the 3T DRAM cell205. In graph 403, a voltage value is represented along the x-axis. Eachlogical value is stored as a different voltage value. As is discussedearlier in regards to FIG. 4, the voltage value representing eachlogical value may not be exactly zero or “V₁”, “V₂”, etc. Instead, thevoltage value may be within some voltage value above or below thetargeted voltage values of zero, “V₁”, “V₂”, for example. Accordingly,voltage values that may register as a particular logical value arerepresented as an individual bell curve in graph 403. Each bell curvecaptures a potential distribution of voltage values that may correspondto a respective logical value.

The manner in which the voltage values are assigned to representdifferent logical values is not limited to this example and otherassigning schemes may be used. That is, the assignment scheme between avoltage value and a corresponding logical value is discussed for thepurpose of illustrating an embodiment and is not meant to be limiting ofthe type of assigning scheme that may be used. For example, the logicalvalue “0” may be stored as a voltage value “0” while the logical value“7” is stored as a voltage value “V₇”. Graph 403 captures one exampleway in which different voltage values may be used to represent differentlogical values. Additionally, any assigning scheme discussed in thedocument is considered an example and shall not constitute a limitingexample.

During a read operation of the 3T DRAM cell 205, the read word line RWL247 goes high, turning on transistor 241 and coupling the read bit lineRBL to ground through the access transistor 241 in series with thestorage transistor 239. The amount of current (i_(DS)) flowing throughthe storage transistor 239 depends on the voltage value of V_(data) 2901stored on its gate. In other words, storage transistor 239 may be viewedas a current source 2913 having a magnitude corresponding to the voltagevalue of V_(data) 2901 stored on its gate. Thus, the twoseries-connected transistors 241 and 239 depicted in diagram 2907 asseries structure 2905 may be viewed as the corresponding seriesstructure 2911 depicted in diagram 2909 which includes variable currentsource 2913 taking the place of storage transistor 239. Since in thisconfiguration the current flowing through the variable current source2913 flows from the read bit line RBL to ground, the variable currentsource 2913 is also referred to herein as a variable current sink 2913.

The magnitude of the variable current source 2913 depends on the voltagevalue of V_(data) 2901. Recall the different V_(GS) curves shown ingraph 305 for different values of V_(GS). The higher voltage value ofV_(GS) (e.g., curve 325) corresponds to a larger magnitude of currentthan a lower voltage value of V_(GS) (e.g., curve 317). This isrepresented in diagram 2903, which shows respective magnitudes ofcurrent (I₀, I₁, . . . , I₇) corresponding to the respective voltagevalue (V₀, V₁, . . . , V₇) of V_(data) 2901. Each such current value isrepresented as an individual bell curve in graph 2903 as a result of thepotential distribution of the respective voltage values.

The next several figures depict embodiments for determining themagnitude of the selected memory cell current (i.e., the value ofvariable current source 2913), which can then be used to determine thevoltage value of V_(data) stored in the memory cell, which in turn canbe correlated to a logical value stored in the memory cell.

Referring now to FIG. 30, an embodiment 3001 is shown for determiningthe magnitude of the selected memory cell current which utilizes a timeto discharge circuit. In this configuration the read bit line RBL 3019is loaded with a fixed bias current source 3011 connected to the upperpower supply V_(DD). When the read word line RWL 247 is activated (e.g.,driven high), the variable current sink 2913 in the selected memory cellis coupled to the read bit line RBL 3019 and sinks current from the readbit line RBL 3019. The fixed bias current source 3011 provides a sourceof current into the read bit line RBL 3019. The interaction of the fixedbias current source 3011, the variable current sink 2913, and thereal-world characteristics of the read access transistor 241 combine todetermine a resulting voltage on the read bit line RBL 3019. Inparticular, the voltage of the read bit line RBL 3019 will largely bedetermined by the larger of the fixed bias current 3011 and the variablecurrent sink 2913, since the larger of these two currents will overpowerthe smaller current and drive the voltage of the read bit line RBL 3019toward the larger magnitude current device.

Optional current divider transistor 3020 can be included to limit thevoltage excursion on the read bit line 3019, as well as to moredeterministically set the voltage of the read bit line 3019 based uponthe difference in magnitude between the fixed bias current 3011 and thevariable current sink 2913. In other words, the voltage of the read bitline 3019 will increase as the net current flowing into the read bitline 3019 increases, because the diode-connected transistor 3020 willoperate higher on its characteristic I-V curve.

The voltage of the read bit line RBL 3019 may be determined by using atime to discharge technique as described earlier herein. In thisembodiment, a sensing circuit (i.e., discharge circuit) 2620 comprisestwo N-channel transistors 2626 and 2624 connected in series between adischarge node 3030 and ground. The gate terminal of transistor 2626 iscoupled to the read bit line 3019, and the gate terminal of transistor2624 is coupled to an enable signal EN conveyed on node 3018. A thirdP-Channel transistor 2622 couples the discharge node 3030 to VDD whenthe enable signal EN coupled to its gate terminal is inactive (e.g.,low). Similar to the description in regards to FIG. 8, when the enablesignal EN is active (e.g., high), the discharge node 3030 will dischargea rate based on the voltage of the read bit line 3019, which voltage, asmentioned above, likewise depends on the current I_(data) flowingthrough variable current sink 2913 within the selected memory cell.

A time to discharge circuit 3032, such as described herein in regards toFIG. 15 or FIG. 34, may be coupled to the discharge node 3030 and drivenby a strobe clock signal STROBE CLK conveyed on node 3034, to generate adigital output reflective of the magnitude of the current through theselected memory cell 2911.

Referring now to FIG. 31, an embodiment 3101 is shown for determiningthe magnitude of the selected memory cell current, which utilizes avariable bias current load device and a comparator. In this embodimentthe read bit line RBL 3119 is loaded with a variable bias current source3111 connected to the upper power supply V_(DD). When the read word lineRWL 247 is driven high, the variable current source 2913 in the selectedmemory cell is coupled to the read bit line RBL 3119 and sinks currentfrom the read bit line RBL 3119, while the variable bias current 3111sources current into the read bit line RBL 3119. The relative magnitudesof the variable bias current source 3111 and the variable current source2913 largely determine a resulting voltage on the read bit line RBL3119, since the larger of these two currents will overpower the smallercurrent and drive the voltage of the read bit line RBL 3119 toward thelarger current source. For example, if the magnitude of the variablebias current 3111 is greater than the magnitude of the variable currentsource 2913, the voltage of the read bit line RBL 3119 will increase(since there is a net current flowing into the read bit line RBL 3119)until the voltage either reaches the V_(DD) voltage level, or until themagnitude of the variable bias current 3111 decreases due to thenon-ideality of its constant current therethrough with diminishingvoltage thereacross. Conversely, if the magnitude of the variable biascurrent 3111 is smaller than the magnitude of the variable currentsource 2913, the voltage of the read bit line RBL 3119 will decrease(since there is a net current flowing out of the read bit line RBL 3119)until the voltage either reaches the ground (e.g., V_(SS)) voltagelevel, or until the magnitude of the variable current source 2913decreases due to the non-ideality of its constant current value withdiminishing voltage (e.g., corresponding to transistor 239 no longeroperating in the saturated region, but rather, as its V_(DS) decreases,operating in the linear region).

Since the voltage of the read bit line RBL 3119 is essentially driven toeither a relatively high voltage (near VDD) or a relatively low voltage(near ground) based upon the larger of the two current sources, thevoltage of the read bit line RBL 3119 can be determined by a simplecomparator 3121 and a reference voltage generally between V_(DD) andground. The read bit line RBL 3119 is compared to a reference voltage3123, and the comparator's output indicates whether the read bit line ishigher or lower than the reference voltage 3123. In some embodiments,the reference voltage can be approximately at the midpoint betweenV_(DD) and ground.

The magnitude of the variable bias current source 3111 can be changed tosuccessive values, and a new comparison performed for each successivevalue, to determine the value of the current through the variablecurrent source 2913 of the selected memory cell. This is depicted indiagram 3103, which shows values of the bias current I_(bias) havingrespective magnitudes (I_(bias1), I_(bias2), . . . , I_(bias6)) betweenadjacent pairs of cell current magnitudes. For example, if the variablebias current 3111 is set to a value of I_(bias3) (which has a magnitudebetween I_(bias3) and I_(bias4)), the comparator 3121 output willindicate whether the memory cell current (i.e., variable current source2913) is either less than I_(bias3) (i.e., either I₀, I₁, I₂, or I₃), orgreater than I_(bias3) (i.e., either I₄, I₅, I₆, or I₇). Similarly, ifthe variable bias current 3111 is set to a value of I_(bias4) (which hasa magnitude between I₄ and I₅), the comparator 3121 output will indicatewhether the memory cell current is either less than or greater thanI_(bias4).

In some embodiments, the variable bias current source 3111 can beincrementally varied from the lowest value, I_(bias1), to the highestvalue, I_(bias6), to determine the magnitude of the memory cell currentthrough the variable current source 2913. Such a technique may be viewedas a linear search through all possible values of the bias current,I_(bias), to determine the memory cell current. In some embodiments, thevariable bias current 3111 can be varied in a binary search fashion todecrease the number of required comparisons. In such a binary search,the I_(bias) current can be set to the middle value within a range ofpossible values and a comparison performed. The result of the comparisondetermines which value of bias current to use for the next comparison.Each comparison eliminates half the remaining choices, so the totalnumber of comparisons can be reduced substantially. In the case of 8possible current magnitudes, a linear search may require up to 7comparisons before determining the memory cell current, whereas a binarysearch requires only 3 comparisons. An example binary search method isfurther described below in regards to FIG. 33. It should be noted thatother binary search techniques are contemplated, including varying avoltage magnitude instead of a current magnitude. For example, a voltageapplied to a transistor can be varied instead of varying a current. Inanother example for a traditional NVM memory, the word line voltage canbe varied using a binary search rather than an incremental monotonicincrease or decrease in word line voltage during a read operation, toreduce the number of comparisons required to determine the data storedin a multi-level memory cell. Moreover, a binary search can be utilizedin any embodiment described above in which the word line voltage orother sensing-related circuit node voltage is shown as monotonicallyincreasing or decreasing.

Referring now to FIG. 32, another embodiment 3201 is shown whichutilizes a variable bias current load device and a comparator, but whichalso includes a pair of cascode transistors for limiting the voltageexcursion on the sense line input to the comparator. In this embodimenta variable bias current source 3211 is connected to the upper powersupply V_(DD), and a first cascode transistor 3229 is coupled betweenthe variable bias current source 3211 and a sense node 3231. A secondcascode transistor 3225 is coupled between the sense node 3231 and theread bit line RBL 3219. A comparator 3221 compares the sense node 3231against a reference voltage 3223 and generates a comparator outputaccordingly.

As before, when the read word line RWL 247 is driven high, the variablecurrent source 2913 in the selected memory cell sinks current from theread bit line RBL 3219, while the variable bias current source 3211sources current into the sense node 3231 and into the read bit line RBL3219. The larger of these two currents will overpower the smallercurrent and drive the voltage of the sense node 3231 toward the largercurrent source. But the two cascode transistors 3225, 3229 serve tolimit the voltage excursion of the sense node 3231 and the read bit lineRBL 3219. For example, if the magnitude of the variable bias currentsource 3211 is greater than the magnitude of the variable current source2913, the voltage of the sense node 3231 will increase, but will stopwhen the voltage of the sense node 3231 reaches a value that is athreshold voltage below the V_(bias1) voltage on the gate of the cascodetransistor 3229. Similarly, the voltage of the read bit line RBL 3219will increase, but will stop when its voltage reaches a value that is athreshold voltage below the V_(bias2) voltage on the gate of the cascodetransistor 3225. Since both the read bit line RBL 3219 and the sensenode 3231 can have very high capacitance, limiting the voltage excursioncan improve cycle-to-cycle performance.

The cascode transistors have an additional beneficial aspect of limitingthe voltage extremes across both current sources, which improves theideality of the constant current value. For example, the cascodetransistor 3225 limits the upper value of voltage on the read bit lineRBL 3219 to the magnitude of V_(bias2) minus the threshold voltage oftransistor 3225. Without the cascode transistor 3225 present, themaximum voltage on the read bit line 3219 (and correspondingly thevoltage across the variable current source 2913) would increase to amuch higher voltage. By including the cascode transistor 3225, themaximum voltage on the read bit line 3219 (and correspondingly thevoltage across the variable current source 2913) remains within a muchsmaller range, and which improves the constant current ideality of thevariable current source 2913.

During operation, the voltage of the sense node 3231 is driven to avoltage that is either somewhat higher than the reference voltage 3223,or somewhat lower than the reference voltage 3223. The comparator 3221compares the sense node 3231 against the reference voltage 3223 togenerate an output that indicates whether the sense node 3231 is higheror lower than the reference voltage 3223.

As before, the magnitude of the variable bias current 3211 can bechanged to successive values, and a new comparison performed for eachsuccessive value, to determine the value of the current through thevariable current source 2913 of the selected memory cell (represented byseries-pair 2911). This is depicted in diagram 3203, which shows valuesof the bias current I_(bias) having respective magnitudes (I_(bias1),I_(bias2), . . . , I_(bias6)) between adjacent pairs of possible valuesof cell current. In some embodiments, the variable bias current 3211 canbe incrementally varied to implement a linear search to determine thememory cell current. In some embodiments, the variable bias current 3211can be varied in a binary search fashion to decrease the number ofrequired comparisons.

Referring now to FIG. 33, a generalized example method 3300 forperforming such a binary search is described. In this example, assumeeight possible values of the read current, being I₂, . . . , I₈, andseven values of the bias current, each interposed between adjacent pairsof possible read current values, being I_(bias1), I_(bias2), . . . ,I_(bias7). The procedure begins at START block 3302. At block 3304, avariable N is set to the number of possible values of read current,which is set to a value of eight in this example. Also, a variable i isset to N/2, which in this example is thus set to a value of four.

Flow then proceeds to block 3306, which compares the read current to theI_(biasi) current. At this point the selected bias current is the middlevalue of bias current, which is I_(bias4). If the read current is lessthan the I_(biasi) current, decision block 3308 directs the flow toblock 3310, which performs a check to determine whether the binarysearch is complete. At this point, of course, it is not complete, as Nhas a value equal to 8. Flow therefore proceeds to block 3312, whichsets N equal to half its previous value, and sets i equal to itsprevious value minus N/2. This has the effect of reducing by half thenumber of remaining possible values of read current, and setting a newbias current in the middle of this new range of remaining possiblevalues. Under the assumptions in this example, at this point the valueof N=4, the value of i=2, and the selected bias current is nowI_(bias2). Flow then returns to block 3306 to perform a comparison ofread current against the I_(bias2) current.

If the read current is greater than the I_(bias2) current, decisionblock 3308 directs the flow to block 3316, which performs a check todetermine whether the binary search is complete. Under the assumptionsthus far, at this point N/2 has a value equal to 2, and the search isnot complete. Flow therefore proceeds to block 3318, which sets N equalto half its previous value, and sets i equal to its previous value plusN/2. This has the effect of reducing by half the number of remainingpossible values of read current, and setting a new bias current in themiddle of this new range of remaining possible values. Under theassumptions thus far, at this point the value of N=2, the value of i=3,and the selected bias current is now I_(bias3).

Flow then returns to block 3306 to perform another comparison of readcurrent to the I_(biasi) current (e.g., now set to I_(bias3)). If theread current is less than the I_(biasi) current, decision block 3308directs the flow to block 3310 to determine whether the binary search iscomplete. At this point N/2 has a value equal to 1, and the search iscomplete. Flow therefore proceeds to block 3314, which deems the readcurrent has a value of I_(read(i)) (e.g., I_(read3) under this example)and the procedure stops at END block 3322. Alternatively, if the readcurrent is greater than the I_(biasi) current (e.g., now set toI_(bias3)), decision block 3308 directs the flow to block 3316, whichlikewise determines that the binary search is complete. Flow thereforeproceeds to block 3320, which deems the read current has a value ofI_(read(i+1)) (e.g., I_(bias4) under this example) and the procedurestops at END block 3322.

Many details of such a binary search can be changed without departingfrom the general technique. For example, the subscript notations for Npossible values can run from 1 to N, or can run from 0 to N−1, or someother scheme, and the specific details of certain method blocks aremodified accordingly. Nevertheless, such a binary search functions toeliminate half the possible values with each comparison, and to resetthe reference current (i.e., bias current) to a new value at or near themidpoint of the remaining range of possible values before the nextcomparison.

Several embodiments described herein, such as embodiments in FIGS. 9,10, 12, etc., may be used to implement a function such as an activationfunction or a threshold function or a weighted function or a logisticfunction. That is, in several embodiments discussed herein, anactivation function may define the output of a storage node whereV_(data) is stored, given an input or set of inputs. The particularactivation function or logistic function that applies are several andvaried. Further, several embodiments discussed herein may be used toperform operations that are arithmetic or logical.

As can be appreciated, many of the embodiments described hereinincorporate a memory cell having an impedance that varies in accordancewith the data value stored therein (i.e., a variable impedance memorycell). The data value is read from the memory cell based upon a variabletime delay of a related circuit node (i.e., signal node), for example, abit line, a read bit line, etc. In some embodiments, a signal node isdischarged at a rate that varies in accordance with the data valuestored in the memory cell, and the time for that signal node todischarge to a particular value can be measured, and the data valueinferred from that time-to-discharge measurement. Such time-to-dischargeread techniques can be utilized with many types of memory circuits, asnoted herein, and particularly to volatile and non-volatile memorytechnologies, including PN Junction memory devices, resistive memorydevices, magnetoresistive memory devices, and spin-torque memorydevices, and further including memory devices based upon silicon, carbon(e.g., carbon nanotubes), or other non-silicon semiconductor materials.In addition, the teachings herein regarding time-to-discharge readtechniques and corresponding circuits may also be applied to analogoustime-to-charge read techniques and corresponding circuits, such as, forexample, in an embodiment having a P-type transistor whose sourceterminal is coupled to an upper power supply node instead of an N-typetransistor whose source terminal is coupled to a lower power supplynode. Consequently, such time-to-discharge and time-to-charge techniquesand embodiments described herein may collectively be viewed as“time-to-transition” techniques in which a circuit (e.g., a readcircuit, a memory cell selection circuit, etc.), effects a voltagetransition of one node (e.g., a signal node) at a variable ratecorresponding to the voltage of another node. In various embodiments,the signal node can be a bit line, a read bit line, and/or othersuitable circuit node. In some embodiments, such a technique includesdetermining a variable time delay of a signal node voltage changecorresponding to a variable impedance of a selected memory cell or otherfunctional circuit. In some embodiments, such a technique includesdetermining a variable time delay of a signal node voltage changecorresponding to the voltage of a first node that results from a firstcircuit coupling a signal value onto the first node. In some embodimentsthe first circuit can be a memory cell, such as a 1TDRAM memory cell. Insome embodiments the first circuit can be a function circuit.

In some of the embodiments described above, a calibration operation,such as a calibration time-to-transition measurement, is performedbefore actually sensing data from a selected memory cell. Such acalibration operation can remove the effects of any offsets (e.g.,comparator offset voltage, transistor mismatch, resistance mismatch,etc.) when reading a selected memory cell, because in a given data paththe same offsets affect the calibration operation in the same fashion asthey affect the read operation. This is particularly helpful with modernprocesses incorporating extremely scaled transistors operating at verylow voltages.

Consistent with the above disclosure, the examples enumerated in thefollowing clauses are specifically contemplated and are intended as anon-limiting set of examples.

Clause 1. A memory device comprising:

-   -   a plurality of memory cells, each memory cell having a variable        impedance that varies in accordance with a respective data value        stored therein; and    -   a read circuit configured to read the data value stored within a        selected memory cell based upon a variable time delay        determination of a signal node voltage change corresponding to        the variable impedance of the selected memory cell.

Clause 2. The memory device according to clause 1, wherein:

-   -   each respective data value corresponds to a plurality of bits.

Clause 3. The memory device according to any preceding clause, wherein:

-   -   the variable impedance comprises a variable current.

Clause 4. The memory device according to any preceding clause, wherein:

-   -   the variable impedance of each memory cell arises from a        transistor within the cell whose gate voltage varies with the        data written thereto.

Clause 5. The memory device according to any preceding clause, wherein:

-   -   the plurality of memory cells comprises volatile memory cells.

Clause 6. The memory device according to any preceding clause, wherein:

-   -   the plurality of memory cells comprises non-volatile memory        cells.

Clause 7. The memory device according to any preceding clause, wherein:

-   -   each memory cell comprises more than one transistor whose        respective gate voltage varies with the data written thereto;        and    -   said more than one transistor together determine the variable        impedance of the memory cell.

Clause 8. The memory device according to any preceding clause, wherein:

-   -   the signal node comprises a read bit line node.

Clause 9. The memory device according to any preceding clause, wherein:

-   -   the read circuit, together with a selection circuit, is        configured to effect a change in voltage of the signal node at a        variable rate corresponding to the variable impedance of the        selected memory cell, and to read the data value stored within        the selected memory cell based upon the variable time delay        determination of the signal node voltage change.

Clause 10. The memory device according to any preceding clause, wherein:

-   -   the read circuit is configured to discharge the signal node at a        variable rate corresponding to the variable impedance of a        selected memory cell;    -   the variable time delay determination of the signal node voltage        change comprises a time-to-discharge measurement of the signal        node voltage change; and    -   the signal node comprises a read bit line node.

Clause 11. The memory device according to any preceding clause, wherein:

-   -   the read circuit is configured to charge the signal node at a        variable rate corresponding to the variable impedance of a        selected memory cell;    -   the variable time delay determination of the signal node        comprises a time-to-charge measurement of the signal node; and    -   the signal node comprises a read bit line node.

Clause 12. A memory device comprising:

-   -   a plurality of memory cells in an array; and    -   a read circuit configured to effect a voltage transition of a        signal node at a variable rate corresponding to a data value        stored within a selected memory cell, and to perform a        time-to-transition measurement of the signal node to determine        the data value stored within the selected memory cell.

Clause 13. The memory device according to clause 12, wherein:

-   -   each respective data value corresponds to a plurality of bits.

Clause 14. The memory device according to any of clauses 12-13, wherein:

-   -   the variable impedance of each memory cell arises from a        transistor within the cell whose gate voltage varies with the        data written thereto.

Clause 15. The memory device according to any of clauses 12-14, wherein:

-   -   the plurality of memory cells comprises volatile memory cells.

Clause 16. The memory device according to any of clauses 12-15, wherein:

-   -   each memory cell comprises more than one transistor whose gate        voltage varies with the data written thereto; and    -   said more than one transistor together determine the variable        impedance of the memory cell.

Clause 17. The memory device according to any of clauses 12-16, wherein:

-   -   the read circuit is further configured to perform, before        selecting the selected memory cell, a calibration        time-to-transition measurement of the signal node to calibrate a        reference condition of the signal node; and    -   the read circuit is further configured to compare the        time-to-transition measurement against the calibration        time-to-transition measurement to determine the data value        stored in the selected memory cell.

Clause 18. The memory device according to any of clauses 12-17, whereinthe read circuit comprises:

-   -   a time-to-discharge measurement circuit having an input coupled        to the signal node, and having a delay line that includes a        plurality of delay stages, each coupled to a respective one of a        plurality of registers that are responsive to a common strobe        clock.

Clause 19. The memory device according to any of clauses 12-18, whereinthe time-to-discharge measurement circuit further comprises:

-   -   an input stage having an input coupled to the signal node, and        having an output coupled to the delay line, said input stage        configured to generate a timing signal on its output when the        signal node has fallen to a predetermined percentage of its        initial voltage.

Clause 20. The memory device according to any of clauses 12-19, wherein:

-   -   the signal node comprises a read bit line node; and    -   each respective data value corresponds to a plurality of bits.

References to “one embodiment”, “an embodiment”, “some embodiments”,“various embodiments”, or the like indicate that a particular element orcharacteristic is included in at least one embodiment of the invention.Although the phrases may appear in various places, the phrases do notnecessarily refer to the same embodiment or example.

Regarding terminology used herein, many of the node names and signalnames include subscripts to better distinguish between distinctinstantiations of similar nodes and signals (e.g., WL₀ and WL₁), as suchusage is well understood in the art. Nevertheless, any inadvertent useherein without such subscript is not intended to imply any differencerelative to a subscripted version of the same name (e.g., Vbias andV_(bias)) unless the context clearly requires such. In addition, any useherein of a term including a lower case portion thereof is not intendedto imply any difference relative to an upper case version of the samename (e.g., V_(TH) and V_(th)) unless the context clearly requires such.

Regarding terminology used herein, it will be appreciated by one skilledin the art that any of several expressions may be equally well used whendescribing the operation of a circuit including the various signals andnodes within the circuit. Any kind of signal, whether a logic signal ora more general analog signal, takes the physical form of a voltage level(or for some circuit technologies, a current level) of a node within thecircuit. It may be correct to think of signals being conveyed on wiresor buses. For example, one might describe a particular circuit operationas “the output of circuit 10 drives the voltage of node 11 toward VDD,thus asserting the signal OUT conveyed on node 11.” This is an accurate,albeit somewhat cumbersome expression. Consequently, it is well known inthe art to equally describe such a circuit operation as “circuit 10drives node 11 high,” as well as “node 11 is brought high by circuit10,” “circuit 10 pulls the OUT signal high,” and “circuit 10 drives OUThigh.” Such shorthand phrases for describing circuit operation usedherein are more efficient to communicate details of circuit operation,particularly because the schematic diagrams in the figures clearlyassociate various signal names with the corresponding circuit blocks andnodes. For convenience, and otherwise unnamed node conveying the CLKsignal may be referred to as the CLK node. Similarly, phrases such as“pull high.” “drive high,” and “charge” are generally synonymous unlessotherwise distinguished, as are the phrases “pull low,” “drive low,” and“discharge.” It is believed that use of these more concise descriptiveexpressions enhances clarity and teaching of this disclosure. It is tobe appreciated by those skilled in the art that each of these and othersimilar phrases may be interchangeably used to describe common circuitoperation, and no subtle inferences should be read into varied usagewithin this description.

An insulated gate field effect transistor (IGFET) may be conceptualizedas having a control terminal which controls the flow of current betweena first current handling terminal and a second current handlingterminal. Although IGFET transistors are frequently discussed as havinga drain, a gate, and a source, in most such devices the drain isinterchangeable with the source. This is because the layout andsemiconductor processing of the transistor is frequently symmetrical(which is typically not the case for bipolar transistors). For anN-channel IGFET transistor, the current handling terminal normallyresiding at the higher voltage is customarily called the drain. Thecurrent handling terminal normally residing at the lower voltage iscustomarily called the source. A sufficient voltage on the gate(relative to the source voltage) causes a current to therefore flow fromthe drain to the source. The source voltage referred to in N-channelIGFET device equations merely refers to whichever drain or sourceterminal has the lower voltage at any given point in time. For example,the “source” of the N-channel device of a bi-directional CMOS transfergate depends on which side of the transfer gate is at the lower voltage.To reflect this symmetry of most N-channel IGFET transistors, thecontrol terminal may be deemed the gate, the first current handlingterminal may be termed the “drain/source”, and the second currenthandling terminal may be termed the “source/drain”. The source and drainterminals may also be referred to as conduction electrodes. Such adescription is equally valid for a P-channel IGFET transistor, since thepolarity between drain and source voltages, and the direction of currentflow between drain and source, is not implied by such terminology.Alternatively, one current-handling terminal may arbitrarily deemed the“drain” and the other deemed the “source”, with an implicitunderstanding that the two are not distinct, but interchangeable. Itshould be noted that IGFET transistors are commonly referred to asMOSFET transistors (which literally is an acronym for“Metal-Oxide-Semiconductor Field Effect Transistor”), even though thegate material may be polysilicon or some material other than metal, andthe dielectric may be oxynitride, nitride, or some material other thanoxide. The casual use of such historical legacy terms as MOS and MOSFETshould not be interpreted to literally refer to only a metal gate FEThaving an oxide dielectric.

Regarding power supplies, a single positive power supply voltage (e.g.,a 2.5 volt power supply) used to power a circuit is frequently named the“V_(DD)” power supply. In an integrated circuit, transistors and othercircuit elements are actually connected to a V_(DD) terminal or a V_(DD)node, which is then operably connected to the V_(DD) power supply. Thecolloquial use of phrases such as “tied to V_(DD)” or “connected toV_(DD)” is understood to mean “connected to the V_(DD) node”, which istypically then operably connected to actually receive the V_(DD) powersupply voltage during use of the integrated circuit. The referencevoltage for such a single power supply circuit is frequently called“V_(SS).” Transistors and other circuit elements are actually connectedto a V_(SS) terminal or a V_(SS) node, which is then operably connectedto the V_(SS) power supply during use of the integrated circuit.Frequently the V_(SS) terminal is connected to a ground referencepotential, or just “ground.” Describing a node which is “grounded” by aparticular transistor or circuit (unless otherwise defined) means thesame as being “pulled low” or “pulled to ground” by the transistor orcircuit.

Generalizing somewhat, the first power supply terminal is frequentlynamed “V_(DD)”, and the second power supply terminal is frequently named“V_(SS).” Historically the nomenclature “V_(DD)” implied a DC voltageconnected to the drain terminal of an MOS transistor and V_(SS) implieda DC voltage connected to the source terminal of an MOS transistor. Forexample, legacy PMOS circuits used a negative V_(DD) power supply, whilelegacy NMOS circuits used a positive V_(DD) power supply. Common usage,however, frequently ignores this legacy and uses V_(DD) for the morepositive supply voltage and V_(SS) for the more negative (or ground)supply voltage unless, of course, defined otherwise. Describing acircuit as functioning with a “V_(DD) supply” and “ground” does notnecessarily mean the circuit cannot function using other power supplypotentials. Other common power supply terminal names are “V_(CC)” (ahistorical term from bipolar circuits and frequently synonymous with a+5 volt power supply voltage, even when used with MOS transistors whichlack collector terminals) and “GND” or just “ground.”

The block diagrams herein may be described using the terminology of asingle node connecting the blocks. Nonetheless, it should be appreciatedthat, when required by the context, such a “node” may actually representa pair of nodes for conveying a differential signal, or may representmultiple separate wires (e.g., a bus) for carrying several relatedsignals or for carrying a plurality of signals forming a digital word.

While the disclosed devices and techniques have been described in lightof the embodiments discussed above, one skilled in the art will alsorecognize that certain substitutions may be easily made in the circuitswithout departing from the teachings of this disclosure. Also, manycircuits using NMOS transistors may be implemented using PMOStransistors instead, as is known in the art, provided the logic polarityand power supply potentials are reversed. In this vein, the transistorconductivity type (i.e., N-channel or P-channel) within a CMOS circuitmay be frequently reversed while still preserving similar or analogousoperation. Moreover, implementation of the disclosed devices andtechniques is not necessarily limited to CMOS technology, and thusimplementations utilizing NMOS, PMOS, and various bipolar or othersemiconductor fabrication technologies are also contemplated, includingPN junction memory devices and nanotube devices.

The various techniques, structures, and methods described above arecontemplated to be used alone as well as in various combinations. Theabove discussion is meant to be illustrative of the principles andvarious embodiments of the present invention, and it should beunderstood that the drawings and detailed description herein are to beregarded in an illustrative rather than a restrictive manner, and arenot intended to be limiting to the particular forms and examplesdisclosed. Numerous variations and modifications will become apparent tothose skilled in the art once the above disclosure is fully appreciated.It is intended that the following claims be interpreted to embrace allsuch variations and modifications.

What is claimed is:
 1. A memory device comprising: a memory cell havingan impedance that varies in accordance with a respective data valuestored therein; and a delay line coupled to the memory cell, the delayline configured to read the data value stored within the memory cell bydetermining a value based on a position within the delay line.
 2. Thememory device according to claim 1, wherein: the respective data valuecorresponds to a plurality of bits.
 3. The memory device according toclaim 1, wherein: the memory cell comprises a transistor including agate, wherein the impedance of the memory cell corresponds to a voltagevalue of the gate.
 4. The memory device according to claim 2, wherein:the memory cell is a volatile memory cell.
 5. The memory deviceaccording to claim 2, wherein: the memory is a non-volatile memory cell.6. The memory device according to claim 3, wherein: the memory cellcomprises a first transistor with a first gate and a second transistorwith a second gate, wherein the first gate couples a storage node of thememory cell, and the second gate is configured to receive a word linesignal; a voltage of the first gate varies with the respective datavalue stored therein; and the combination of the first and secondtransistors determines the impedance of the memory cell.
 7. The memorydevice according to claim 1, wherein the memory cell further comprises:a bit line coupled to the delay line; and a word line coupled to a firstinput of the memory cell, wherein: the word line is configured to selectthe memory cell at a first time value defined as a time reference, andthe determining the value is performed with respect to the timereference.
 8. The memory device of claim 1, wherein: determining thevalue based on a position within the delay line further comprises thedelay line configured to correlate a measured delay time to a voltagevalue, the voltage value corresponding to the respective data value. 9.The memory device of claim 1, wherein: the delay line comprises: a firstoutput coupled to a first latch of capture latches, a second outputcoupled to a second latch of the capture latches, and the delay line andthe capture latches in combination is configured to correlate adetermined delay time to a voltage value.
 10. The memory device of claim1, wherein determining the value using the delay line further comprisesproviding an output of an activation function.
 11. A method of reading adata value stored in a memory cell, comprising: determining, based on aposition within a delay line, a time-to-transition of a bit line of thememory cell to determine a delay time; correlating the delay time to avoltage value, the voltage value corresponding to the data value; anddetermining the data value based on the voltage value.
 12. The method ofclaim 11, further comprising: selecting the memory cell by applying afirst voltage value to a word line of the memory cell, at a first timevalue; defining a time reference value based on the first time value;and determining the time-to-transition with respect to the timereference value.
 13. The method of claim 12, wherein reading the datavalue stored in the memory cell further comprises implementing afunction, wherein the function comprises at least one selected from thegroup consisting of: an activation function, a threshold function,weighted function, and a logistic function.
 14. The method of claim 11,wherein determining, based on a position within a delay line, atime-to-transition of a bit line, further comprises: capturing theposition, by latch outputs of a delay line wherein the position definesa difference in voltage values; transmitting the difference in thevoltage value to latches; transmitting a strobe signal to the latches;and, in response to transmitting the strobe signal, capturing the latchoutputs.
 15. The method of claim 14, further comprising: comparing thelatch outputs to a measured calibration delay; and determining the datavalue stored in the memory cell based on the comparing.
 16. The methodof claim 11, further comprising: storing a first data value in thememory cell using a first voltage value, wherein the first voltage valuecreates a first impedance value of the memory cell; storing a seconddata value in the memory cell using a second voltage value, wherein thesecond voltage value creates a second impedance value of the memorycell; and storing the data value as a third data value in the memorycell using a third voltage value, wherein the third voltage valuecreates a third impedance value of the memory cell.
 17. The method ofclaim 16, wherein the memory cell comprises: a bit line coupled to thedelay line; and a word line coupled to a first input of the memory cell.18. The method of claim 17, wherein the memory cell further comprises: afirst transistor with a first gate and a second transistor with a secondgate, wherein a voltage of the first gate and a voltage of the secondgate varies with the data value stored in the memory cell.
 19. Themethod of claim 18, further comprising storing the second bit value byvarying the impedance of the memory cell by varying the voltages of thefirst gate and the second gate.
 20. The method of claim 16, wherein thefirst data value stores a plurality of bits, the second data valuestores a plurality of bits, and the third data value stores a pluralityof bits.